Intel MPCMM0002 manual Airflow Requirements, Board Resistance Curve, Category CMMs

Thermals—MPCMM0002 CMM

Figure 31. Front-to-Back Air Flow

It may be necessary to enclose the area around a CMM when cooled front-to-back to ensure that air is properly channeled across the board and evenly distributed.

11.4Airflow Requirements

General airflow requirements for the CMM are shown in Table 23.

Table 23. Typical Airflow and Cooling Requirements

Category	CMMs
Required LFM	180 LFM (54.864 m/min)
Required CFM	5 CFM (0.1416 m3/min) per CMM
Typical Heat Dissipation	21 W per CMM
Maximum Heat Dissipation	28 W per CMM
Approximate Airflow Resistance	0.2 in.-H2O (~46 Pa)

11.5Board Resistance Curve

As described in Chapter 5 of the PICMG* 3.0 specification, all board vendors are required to provide a flow pressure curve for their board along with the airflow requirements for specific wattages. This enables system integrators to compare the slot resistance curves of their shelves with the resistance and airflow requirements of their blades to approximate whether a given chassis can cool a particular blade.

The MPCMM0002 CMM is not subject to this requirement because the board is not an AdvancedTCA standard form factor. Flow pressure curves will vary widely depending upon location of the MPCMM0002 CMM in a chassis and the type/amount of airflow across the MPCMM0002 CMM at that location.

	Intel NetStructure® MPCMM0002 Chassis Management Module
July 2007	Hardware TPS
Order Number: 309247-004US	57