Management Module
12.0Management Module Specifications
12.1Feature Summary
Key
•Full shelf management controller and shelf manager capability as defined in the PICMG 3.0 specification with support for up to 16 board slots in an AdvancedTCA* chassis.
•Hybrid dual IPMB star topology support for improved reliability, security, and throughput.
•Slim 4U x 282.5 mm x 3HP size to simplify integration into chassis.
•Comprehensive management interfaces including CLI, SNMP, RPC, and RMCP.
•Dual 10/100 Mbps Ethernet controllers front, rear, or on the backplane.
•Dual serial ports (one out front, one out the RTM) for local console support.
•Isolated telecom alarm connections front or rear to connect to standard telecom alarms.
•Direct
•Low power design, using less than 30 W.
•
•Dedicated communication paths between dual CMMs for
•Support for CDMs (chassis FRU modules), fan trays, PEMs, and external temperature sensors.
•Integrated backing plate to help meet the full range of standard NEBS tests, including earthquake, fire, immunity, and safety.
•Intel® 80321 processor with Intel XScale® technology, 128 MBytes RAM, and 64 MBytes flash memory to provide headroom for future expansion and space for custom user applications on board.
•Comprehensive software management capabilities, which are detailed in the Intel NetStructure® MPCMM0001 Chassis Management Module and Intel NetStructure® MPCMM0002 CMM Software Technical Product Specification for firmware version 6.1.
| Intel NetStructure® MPCMM0002 Chassis Management Module |
July 2007 | Hardware TPS |
Order Number: | 59 |