5

D1

D1

2

D2

5

E2

E1

E1

2

COUNTRY OF

 

ORIGIN MARK

11.0 REF.

 

3.00REF. DIA.

4 PLACES

BOTTOM VIEW

NOTES

1ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y145H-1982

2THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM PACKAGE BODY SIZE

3DATUMS A-B AND D TO BE DETERMINED AT DATUM

PLANE H

4

TO BE DETERMINED AT SEATING PLANE C

5

DIMENSION D1 AND E1 DO NOT INCLUDE MOLD

 

 

PROTRUSION. ALLOWABLE PROTRUSION IS 0.152 mm

 

 

PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY

 

 

SIZE DIMENSIONS INCLUDING MOLD MISMATCH.

 

 

DIMENSIONS D1 AND E1 SHALL BE DETERMINED AT

 

 

DATUM PLANE H .

6

DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST

 

 

BE LOCATED WITHIN THE ZONE INDICATED.

 

EXACT SHAPE AT EACH CORNER IS OPTIONAL.

 

7

 

8

MEASURED AT GAGE PLANE.

 

9

DIMENSION b DOES NOT INCLUDE DAMBAR

11.0 REF.

PROTRUSION, ALLOWABLE PROTRUSION SHALL BE

 

 

0.08 mm TOTAL IN EXCESS OF THE b DIMENSION AT

 

 

MAXIMUM MATERIAL CONDITION . DAMBAR MAY NOT

 

 

BE LOCATED AT THE LOWER RADIUS OF THE FOOT. THE

 

 

MINIMUM SPACING BETWEEN PROTRUSION AND AN

 

 

 

 

ADJACENT LEAD SHALL NOT BE LESS THAN 0.07 mm.

10PLATING THICKNESS 0.007 MIN. TO 0.020 MAX. SOLDER PLATE 855n/ISPO.

11THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 mm AND 0.25 mm FROM THE LEAD TIP.

12A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY.

Figure 26. Bottom View of Package

12°

- 16°

SEE DETAIL "B"

 

 

 

 

A

 

 

 

 

 

 

 

SEATING

 

e

2

DATUM PLANE

 

 

 

H

 

 

 

PLANE

 

 

 

 

 

C

ccc

b

 

C

 

 

 

 

 

 

Figure 27. Side View of Package

 

 

 

 

 

 

0.40 MIN.

 

 

 

 

2

0° MIN.

 

 

 

 

 

 

 

 

 

H

R 0.13/0.30

 

 

 

 

 

 

 

 

A2

DATUM

 

 

 

 

PLANE

 

 

 

 

 

0.13 R

C

GAGE

 

 

 

PLANE

 

 

 

MIN.

 

 

 

 

 

 

 

BASE PLANE

 

 

 

0.25

10 0.11/0.23

SEATING

 

 

 

 

11

PLANE

 

 

C

 

 

12

A1

 

 

 

 

0 - 7°

 

 

 

 

 

L

 

 

 

 

 

1.60 REF.

 

 

DETAIL "B"

Figure 28. Detailed View of Pin

WITH LEAD FINISH

9 10 11 b

0.11/0.19 10 11

b1

BASE METAL

1011

SECTION C-C

105

Page 105
Image 105
Agilent Technologies HDMP-3001 manual Bottom View of Package

HDMP-3001 specifications

Agilent Technologies, a prominent name in electronics and measurement technology, offers a wide range of products that cater to various industries. Among its notable offerings is the HDMP-3001, a high-speed, serial data transceiver designed to facilitate robust communications in electronic systems. The HDMP-3001 stands out with its ability to handle high bandwidths, making it particularly suited for applications requiring rapid data transfer, such as telecommunications, computer networking, and high-performance computing.

One of the main features of the HDMP-3001 is its advanced signaling technology. By employing differential signaling, the transceiver minimizes electromagnetic interference and enhances signal integrity. This is crucial in environments with multiple electronic devices operating simultaneously, as it ensures data is transmitted clearly and without degradation.

The HDMP-3001 operates at a maximum data rate of 1 Gbps, allowing for efficient data transfer over short distances. This capability is coupled with a flexible architecture that enables users to configure the transceiver for various applications. The device supports both point-to-point and point-to-multipoint configurations, giving engineers the versatility they need in designing communication links.

Moreover, the HDMP-3001 features on-chip clock recovery functionality, which simplifies system design by reducing the number of external components needed. This built-in feature allows the transceiver to maintain synchronization even as data rates increase, further enhancing performance.

The low power consumption characteristic of the HDMP-3001 is another notable advantage. This makes it an attractive choice for battery-operated devices and systems where power efficiency is critical. The transceiver’s design ensures optimal performance while minimizing heat generation and power draw, enabling longer operational lifetimes.

In terms of physical characteristics, the HDMP-3001 comes in a compact, surface-mount package, allowing for easier integration into various circuit board designs. The small form factor, combined with its innovative technology, makes it a popular choice among engineers seeking to improve data transmission reliability without compromising on space or power constraints.

Overall, Agilent Technologies' HDMP-3001 is a formidable solution for high-speed serial data transmission, characterized by its robust performance, low power consumption, and versatile configuration options. With these features, it continues to be an essential component in the evolving landscape of electronic communications.