7. Electrical and Thermal Specifications

7.1 Technology

0.25 micron CMOS, 1.8V core and 3.3V I/Os.

7.2 Maximum Ratings

Table 23. Absolute Maximum Ratings

Parameter

Min

Max

Units

 

 

 

 

Supply Voltage (VDD)

-0.5

2.5

Volts

 

 

 

 

Supply Voltage (DVDD)

-0.5

4.5

Volts

 

 

 

 

Junction Temperature

0.0

110

° C

 

 

 

 

Storage Temperature

-40

125

° C

 

 

 

 

ESD

 

2

KV

 

 

 

 

Caution: Exceeding the values stated above could permanently damage the device. Prolonged exposure to absolute maximum ratings may affect the reliability of

the device.

Table 24. Operating Conditions

Parameter

Min

Typ

Max

Units

Supply Voltage (DVDD)

2.97

3.3

3.63

Volts

 

 

 

 

 

 

Supply Voltage (VDD)

1.62

1.8

1.98

Volts

 

 

 

 

 

 

Case Temperature

0

25

85

° C

 

 

 

 

 

 

7.3Thermal Characteristics Table 25. Thermal Performance

Symbol

Parameter

Units

Typ.

Max.

θ

(1)

Thermal Resistance: Junction to Ambient

° C/W

34

 

JA

 

ψ

(2)

Thermal Characterization Parameter: Junction to Package Top

° C/W

10.25

 

JT

 

Notes:

1.θ JA is measured in a still air environment at 25° C on a standard 4 x 4" FR4 PCB as specified in EIA/JESD 51-7.

2.To determine the actual junction temperature in a given application, use the following: TJ = TT + (ψ JT x PD), where TT is the case temperature measured on the top center of the package and PD is the power being dissipated.

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Agilent Technologies HDMP-3001 manual Technology, Micron CMOS, 1.8V core and 3.3V I/Os, Esd, Symbol Parameter Units Typ Max

HDMP-3001 specifications

Agilent Technologies, a prominent name in electronics and measurement technology, offers a wide range of products that cater to various industries. Among its notable offerings is the HDMP-3001, a high-speed, serial data transceiver designed to facilitate robust communications in electronic systems. The HDMP-3001 stands out with its ability to handle high bandwidths, making it particularly suited for applications requiring rapid data transfer, such as telecommunications, computer networking, and high-performance computing.

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