Agilent Technologies HDMP-3001 manual 110, 116, 117, 118

3.9 SONET/SDH Processing		24
3.9.1 Transmit SONET/SDH Processing Overview		24
3.9.2 Receive SONET/SDH Processing Overview		25
3.9.3 Transmit SONET/SDH Processing Details		25
3.9.4 Receive SONET/SDH Processing Details		30
4. Application Information		38
4.1	Chip setup and configuration	38
4.1.1 EEPROM Detection		38
4.2	Configurations	38
4.2.1 PHY and MAC mode		38
4.2.2 SDH and SONET mode		38
4.2.3 LAPS and GFP mode		38
4.2.4 INT Pin Configuration		38
4.3	Firmware and System Design Information	40
4.3.1 Board level pull-ups and pull-downs		40
4.3.2 Motorola MPC860 Microprocessor Interface		40
4.3.3 MII Interface		41
4.3.4 EEPROM Interface		41
5. Register Definitions		42
5.1 MII Management Register Map		42
5.2	Chip Register Map	44
5.3	SONET/SDH Transmit Registers	56
5.4	SONET/SDH Receive Registers	61
5.5	Ethernet Transmit Registers	79
5.6	Ethernet Receive Registers	88
6. Package Specification		104
7. Electrical and Thermal Specifications		107
7.1	Technology	107
7.2 Maximum Ratings		107
7.3	Thermal Characteristics	107
7.4	DC Characteristics	108
7.5	AC Electrical Characteristics	108
7.5.1 General AC Specifications		108
7.5.2 MII Specifications		109
8. Timing Diagrams		110
8.1	Microprocessor Bus Timing - Write Cycle	110
8.2	Microprocessor Bus Timing - Read Cycle	111
8.3	Microprocessor Bus Timing Table	112
8.4	Line Interface Receive and Transmit Timing	112
8.5	TOH Interface E1/E2/F1 Transmit Timing	113
8.6	TOH Interface E1/E2/F1 Receive Timing	114
8.7	DCC Interface Transmit Timing	114
8.8	DCC Interface Receive Timing	115
8.9	JTAG Interface Timing	115
8.10 Reset specification		116
8.11 MII Timing		116
8.12 MDIO Port Timing		117
8.13 EEPROM Port Timing		118
8.14 In Frame Declaration		118
9. Applicable Documents		124

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