4
List of Tables
Table 1. Line Side Interface Pins Description........................................... 8
Table 2. MII Interface Pins Description..................................................... 9
Table 3. Transport Overhead Pins Description ......................................10
Table 4. Microprocessor Interface Pins Description............................. 12
Table 5. JTAG Interface Pins Description............................................... 13
Table 6. Two-Wire EEPROM Interface Pins Description...................... 14
Table 7. Miscellaneous Pins Description................................................. 14
Table 8. Buffer types ..................................................................................16
Table 9. JTAG pins...................................................................................... 21
Table 10. JTAG instructions supported ...................................................21
Table 11. Path RDI bit values ....................................................................27
Table 12. STS-3c/STM-1 TOH/SOH ...........................................................28
Table 13. Pointer Processing..................................................................... 34
Table 14. Pointer Tracking ........................................................................34
Table 15. INT Pin Configuration............................................................... 39
Table 16. Pin Connections – MPC860 ......................................................40
Table 17. Pin Connections – MII Interface.............................................. 41
Table 18. MII Management Register Map ................................................42
Table 19. HDMP-3001 Register Map......................................................... 44
Table 20. G1 values..................................................................................... 59
Table 21. STS-3c/STM-1 Configuration for
RX_FRAME_POSITION [3:0] ..........................................................64
Table 22. Package Dimensions ...............................................................106
Table 23. Absolute Maximum Ratings ...................................................107
Table 24. Operating Conditions ..............................................................107
Table 25. Thermal Performance .............................................................107
Table 26. DC Electrical Characteristics................................................. 108
Table 27. Power Dissipation.................................................................... 108
Table 28. Clock requirements and switching characteristics............. 108
Table 29. MII AC Specification................................................................ 109
Table 30. Timing of microprocessor bus............................................... 112
Table 31. MII signal clocking................................................................... 117
Table 32. EEPROM Interface Timing Parameters................................ 118
This IC was jointly developed with Wuhan Research Institute of Post and Telecommunications