Removal and Replacement Procedures— Small Form Factor (SFF) Chassis

7.8Memory

ÄCAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other.

ÄCAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. Refer to Section 5.2, “Electrostatic Discharge Information” for more information.

ÄCAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module.

1.If you have locked the Smart Cover Lock, use Computer Setup to unlock the lock (Section 7.2).

2.Prepare the computer for disassembly (Section 7.1).

3.Remove the computer cover (Section 7.5).

ÅWARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching.

4.Open both latches of the memory module socket 1, and insert the memory module into the socket 2. Refer to Appendix F, “Memory” for the correct sequence for installing memory modules to get optimal performance.

A memory module can be installed in only one way. Match the notch on the module with the tab on the memory socket.

5.Push the module down into the socket, ensuring that the module is fully inserted and properly seated. Make sure the latches are in the closed position 3.

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Service Reference Guide, dc7600

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HP dc7608 manual Memory