EM78P312N

8-Bit Microcontroller

APPENDIX

A Package Types:

OTP MCU

Package Type

 

 

Pin Count

Package Size

EM78P312NP

DIP

 

28

600 mil

 

 

 

 

 

EM78P312NK

SDIP

28

400 mil

 

 

 

 

 

EM78P312NAK

SDIP

28

300 mil

 

 

 

 

 

EM78P312NM

SOP

28

300 mil

 

 

 

 

 

EM78P312NS

SSOP

28

209 mil

 

 

 

 

 

„Y/S/JGreen product does not contain hazardous substances. The third edition of Sony SS-00259 standard.

Pb content should be less than 100ppm. Pb content to fit in with Sony spec.

 

Part No.

 

 

EM78P311SxY

 

 

 

 

 

 

 

 

 

 

Electroplate type

 

Sn/Cu

 

 

 

 

 

 

 

Ingredient (%)

 

Cu:1.0~3.0%

 

 

 

 

 

 

 

Melting point(°C)

 

~227°C

 

 

 

 

 

 

 

 

Electrical resistivity

13

 

 

 

Ω-cm)

 

 

 

 

 

 

 

 

 

 

 

 

 

Hardness (hv)

10~12

 

 

 

 

 

 

 

 

Elongation (%)

40%

 

 

 

 

 

 

 

 

 

EM78P311SxS/xJ

Pure Tin Sn :100% 232°C

11.4

8~10

>50%

64

Product Specification (V1.0) 10.03.2006

(This specification is subject to change without further notice)

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IBM EM78P312N manual Otp Mcu, Package Type, Pin Count Package Size, EM78P311SxY, EM78P311SxS/xJ