EM78P312N
APPENDIX
A Package Types:
OTP MCU | Package Type |
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|
Pin Count
Package Size
EM78P312NP | DIP |
| 28 | 600 mil |
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EM78P312NK | SDIP | 28 | 400 mil | |
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EM78P312NAK | SDIP | 28 | 300 mil | |
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EM78P312NM | SOP | 28 | 300 mil | |
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EM78P312NS | SSOP | 28 | 209 mil | |
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Y/S/J：Green product does not contain hazardous substances. The third edition of Sony
Pb content should be less than 100ppm. Pb content to fit in with Sony spec.
| Part No. |
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| EM78P311SxY |
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| Electroplate type |
| Sn/Cu |
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| Ingredient (%) |
| Cu:1.0~3.0% |
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| Melting point(°C) |
| ~227°C |
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| Electrical resistivity | 13 |
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| Hardness (hv) | 10~12 |
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| Elongation (%) | 40% |
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EM78P311SxS/xJ
Pure Tin Sn :100% 232°C
11.4
8~10
>50%
64 • | Product Specification (V1.0) 10.03.2006 |
(This specification is subject to change without further notice)
