Manuals
/
Intel
/
Computer Equipment
/
Computer Hardware
Intel
632xESB, 631xESB manual Thermal and Mechanical Design Guidelines, February, Order Number
Models:
632xESB
631xESB
1
1
32
32
Download
32 pages
49.34 Kb
1
2
3
4
5
6
7
8
<
>
Specs
Thermocouple Wire
Reference Thermal Solution
Page 1
Image 1
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal and Mechanical Design Guidelines
February 2007
Order Number:
315263-001
Page 2
Page 1
Image 1
Page 2
Contents
Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal and Mechanical Design Guidelines
February
Order Number
TMDGFebruary 2007
Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications
Figures
Contents
Introduction
Tables
Revision History
1.1 Design Flow
1.0 Introduction
Step 1 Thermal
Figure 1. Thermal Design Process
Simulation
Thermal Model
Reference Documents
1.2 Definition of Terms
Definition of Terms
Introduction-Intel 6321ESB ICH
Intel 6321ESB ICH-Introduction
Referenced Documents
Title
Location
Packaging Technology-Intel 6321ESB ICH
2.0 Packaging Technology
Intel 6321ESB ICH-Packaging Technology
3.1 Thermal Design Power TDP
3.0 Thermal Specifications
Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications
3.2 Die Case Temperature
Intel 6321ESB ICH-Thermal Simulation
4.0 Thermal Simulation
5.1 Characterizing the Thermal Solution Requirement
5.0 Thermal Solution Requirements
ΨCA =
TCASE - TLA
Example 1. Calculating the Required Thermal Performance
Figure 5. Processor Thermal Characterization Parameter Relationships
ΨCA =
TCASE - TLA
T C - T LA
C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W
Table 4. Required Heat Sink Thermal Performance ΨCA
ΨCA =
6.1 Die Case Temperature Measurements
6.0 Thermal Metrology
6.1.1 Zero Degree Angle Attach Methodology
Figure 7. Zero Degree Angle Attach Heatsink Modifications
Figure 6. Thermal Solution Decision Flowchart
Thermal Metrology-Intel 6321ESB ICH
Thermocouple Wire
Figure 8. Zero Degree Angle Attach Methodology Top View
Die Substrate
Cement + Thermocouple Bead
7.1 Operating Environment
7.0 Reference Thermal Solution
7.2 Heatsink Performance
2.3 sigma
7.3 Mechanical Design Envelope
plus
ca mean
ESB2
7.4 Board-Level Components Keepout Dimensions
Heatsink
Motherboard
7.5 Torsional Clip Heatsink Thermal Solution Assembly
Figure 11. Torsional Clip Heatsink Board Component Keepout
7.5.1 Heatsink Orientation
Reference Thermal Solution-Intel 6321ESB ICH
7.5.2 Mechanical Interface Material
Figure 12. Torsional Clip Heatsink Assembly
7.5.3 Thermal Interface Material
7.5.3.1 Effect of Pressure on TIM Performance
7.5.5 Clip Retention Anchors
7.5.4 Heatsink Clip
All measured at 50ºC
Reliability Guidelines
8.0 Reliability Guidelines
Intel 6321ESB ICH-Reliability Guidelines
Test
A.1 Torsional Clip Heatsink Thermal Solution
Appendix A Thermal Solution Component Suppliers
Thermal Solution Component Suppliers-Intel 6321ESB ICH
Part
Mechanical Drawing List
Appendix B Mechanical Drawings
Table 7 lists the mechanical drawings included in this appendix
Intel 6321ESB ICH-Mechanical Drawings
Mechanical Drawings-Intel 6321ESB ICH
Figure 13. Torsional Clip Heatsink Assembly Drawing
Intel 6321ESB ICH-Mechanical Drawings
Figure 14. Torsional Clip Heatsink Drawing
Mechanical Drawings-Intel 6321ESB ICH
Figure 15. Heat Sink Foam Gasket Drawing
Intel 6321ESB ICH-Mechanical Drawings
Figure 16. Torsional Clip Drawing