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Intel 631xESB manual Appendix B Mechanical Drawings, Mechanical Drawing List, Drawing Description

Models: 632xESB 631xESB

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Intel® 6321ESB ICH—Mechanical Drawings

Intel® 6321ESB ICH—Mechanical Drawings

Appendix B Mechanical Drawings

	Table 7 lists the mechanical drawings included in this appendix.
Table 7.	Mechanical Drawing List

	Drawing Description	Figure Number

	Torsional Clip Heatsink Assembly Drawing	Figure 13

	Torsional Clip Heatsink Drawing	Figure 14

	Heat Sink Foam Gasket Drawing	Figure 15

	Torsional Clip Drawing	Figure 16

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 28

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Intel 631xESB, 632xESB manual Appendix B Mechanical Drawings, Mechanical Drawing List, Intel 6321ESB ICH-Mechanical Drawings

Contents

Thermal and Mechanical Design Guidelines Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFebruary Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Figures ContentsIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowFigure 1. Thermal Design Process Step 1 ThermalSimulation Thermal Model1.2 Definition of Terms Reference DocumentsDefinition of Terms Introduction-Intel 6321ESB ICHReferenced Documents Intel 6321ESB ICH-IntroductionTitle Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.0 Thermal Specifications 3.1 Thermal Design Power TDPTable 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.2 Die Case Temperature4.0 Thermal Simulation Intel 6321ESB ICH-Thermal Simulation5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution RequirementΨCA = TCASE - TLAFigure 5. Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceΨCA = TCASE - TLAC ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W T C - T LATable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Figure 8. Zero Degree Angle Attach Methodology Top View Thermocouple WireDie Substrate Cement + Thermocouple Bead7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance 7.3 Mechanical Design Envelope 2.3 sigmaplus ca mean7.4 Board-Level Components Keepout Dimensions ESB2Heatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH Figure 12. Torsional Clip Heatsink Assembly 7.5.2 Mechanical Interface Material7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC 8.0 Reliability Guidelines Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestAppendix A Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionThermal Solution Component Suppliers-Intel 6321ESB ICH PartAppendix B Mechanical Drawings Mechanical Drawing ListTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings