Intel 631xESB, 632xESB Mechanical Design Envelope, sigma, plus, ca mean, LFM through fin area

Intel® 6321ESB ICH—Reference Thermal Solution

Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target at 65C Local-Ambient

	8.000
	7.000
[C/W]							Thermal Target
	6.000						Simulation results with
2.3 sigma)							EOLife TIM performance
	5.000
	4.000
plus
-ca (mean	3.000
	2.000
Psi
	1.000
	0.000
	0	50	100	150	200	250	300	350	400

LFM through fin area

7.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel® 6321ESB ICH thermal solution are shown in Figure 10.

When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub reference heatsink envelope shown in Figure 10, any motherboard components placed between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 20