Intel® 6321ESB ICH—Thermal Metrology

Figure 8. Zero Degree Angle Attach Methodology (Top View)

Thermocouple Wire

Die

Substrate

Cement + Thermocouple Bead

Note: Not to scale.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 18

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Intel 631xESB, 632xESB manual Thermocouple Wire Die Substrate Cement + Thermocouple Bead