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Intel 631xESB Zero Degree Angle Attach Methodology Top View, Thermocouple Wire, Die Substrate

Models: 632xESB 631xESB

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Intel® 6321ESB ICH—Thermal Metrology

Figure 8. Zero Degree Angle Attach Methodology (Top View)

Thermocouple Wire

Die

Substrate

Cement + Thermocouple Bead

Note: Not to scale.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 18

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Intel 631xESB Zero Degree Angle Attach Methodology Top View, Thermocouple Wire, Die Substrate, Cement + Thermocouple Bead

Contents

February Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Contents FiguresIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowSimulation Figure 1. Thermal Design ProcessStep 1 Thermal Thermal ModelDefinition of Terms 1.2 Definition of TermsReference Documents Introduction-Intel 6321ESB ICHTitle Referenced DocumentsIntel 6321ESB ICH-Introduction Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.2 Die Case Temperature 3.0 Thermal Specifications3.1 Thermal Design Power TDP Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications4.0 Thermal Simulation Intel 6321ESB ICH-Thermal SimulationΨCA = 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement TCASE - TLAΨCA = Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance TCASE - TLATable 4. Required Heat Sink Thermal Performance ΨCA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA ΨCA =6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Die Substrate Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Cement + Thermocouple Bead7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance plus 7.3 Mechanical Design Envelope2.3 sigma ca meanHeatsink 7.4 Board-Level Components Keepout DimensionsESB2 Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH 7.5.3 Thermal Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC Intel 6321ESB ICH-Reliability Guidelines 8.0 Reliability GuidelinesReliability Guidelines TestThermal Solution Component Suppliers-Intel 6321ESB ICH Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution PartTable 7 lists the mechanical drawings included in this appendix Appendix B Mechanical DrawingsMechanical Drawing List Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings