Intel 632xESB, 631xESB Reference Thermal Solution, Operating Environment, Heatsink Performance

Reference Thermal Solution—Intel®6321ESB ICH

7.0Reference Thermal Solution

Intel has developed one reference thermal solution to meet the cooling needs of the Intel® 6321ESB I/O Controller Hub component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Torsional Clip Heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions.

7.1Operating Environment

The Intel® 6321ESB ICH reference thermal solution was designed assuming a maximum local-ambient temperature of 65°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 150 linear feet per minute (LFM). The approaching airflow temperature is assumed to be equal to the local- ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 55°C external-ambient temperature at sea level. (External-ambient refers to the environment external to the system.)

7.2Heatsink Performance

Figure 9 depicts the measured thermal performance of the reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 19