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Intel 631xESB Processor Thermal Characterization Parameter Relationships, Ψca =, Tcase - Tla

Models: 632xESB 631xESB

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Figure 5. Processor Thermal Characterization Parameter Relationships

Intel® 6321ESB ICH—Thermal Solution Requirements

Figure 5. Processor Thermal Characterization Parameter Relationships

TA

HEATSINK

TIM TS

TC

Device

ΨSA

ΨCS

ΨCA

Example 1. Calculating the Required Thermal Performance

The cooling performance, ΨCA, is defined using the thermal characterization parameter previously described. The process to determine the required thermal performance to cool the device includes:

1.Define a target component temperature TCASE and corresponding TDP.

2.Define a target local ambient temperature, TLA.

3.Use Equation 1 and Equation 2 to determine the required thermal performance needed to cool the device.

The following provides an example of how you might determine the appropriate performance targets.

Assume:

•TDP = 12.4 W and TCASE = 105° C

•Local processor ambient temperature, TLA = 65° C.

Then the following could be calculated using Equation 1 for the given chipset configuration:

ΨCA =	TCASE – TLA		105 – 65		C
ΨCA =	----------TDP---------------	=	----12.4----------	=	3.23°W---

To determine the required heat sink performance, a heat sink solution provider would need to determine ΨCS performance for the selected TIM and mechanical load configuration. If the heat sink solution were designed to work with a TIM material performing at ΨCS ≤ 0.35 °C/W, solving from Equation 2, the performance needed from the heat sink is:

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 14

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Intel 631xESB, 632xESB manual Processor Thermal Characterization Parameter Relationships, Ψca =, Tcase - Tla, 3.23 W

Contents

February Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Introduction ContentsFigures Revision History Tables1.0 Introduction 1.1 Design FlowSimulation Figure 1. Thermal Design ProcessStep 1 Thermal Thermal ModelDefinition of Terms 1.2 Definition of TermsReference Documents Introduction-Intel 6321ESB ICHTitle Referenced DocumentsIntel 6321ESB ICH-Introduction Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.0 Thermal Specifications3.1 Thermal Design Power TDP 3.2 Die Case Temperature4.0 Thermal Simulation Intel 6321ESB ICH-Thermal SimulationΨCA = 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement TCASE - TLAΨCA = Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance TCASE - TLATable 4. Required Heat Sink Thermal Performance ΨCA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA ΨCA =6.1.1 Zero Degree Angle Attach Methodology 6.0 Thermal Metrology6.1 Die Case Temperature Measurements Thermal Metrology-Intel 6321ESB ICH Figure 6. Thermal Solution Decision FlowchartFigure 7. Zero Degree Angle Attach Heatsink Modifications Die Substrate Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Cement + Thermocouple Bead7.2 Heatsink Performance 7.0 Reference Thermal Solution7.1 Operating Environment plus 7.3 Mechanical Design Envelope2.3 sigma ca meanHeatsink 7.4 Board-Level Components Keepout DimensionsESB2 Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Reference Thermal Solution-Intel 6321ESB ICH 7.5.1 Heatsink OrientationFigure 11. Torsional Clip Heatsink Board Component Keepout 7.5.3 Thermal Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3.1 Effect of Pressure on TIM PerformanceAll measured at 50ºC 7.5.4 Heatsink Clip7.5.5 Clip Retention Anchors Intel 6321ESB ICH-Reliability Guidelines 8.0 Reliability GuidelinesReliability Guidelines TestThermal Solution Component Suppliers-Intel 6321ESB ICH Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution PartTable 7 lists the mechanical drawings included in this appendix Appendix B Mechanical DrawingsMechanical Drawing List Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings