Intel 632xESB, 631xESB manual Definition of Terms, Reference Documents, Term Definition

Introduction—Intel®6321ESB ICH

1.2Definition of Terms

Table 1.	Definition of Terms
	Term	Definition
		Bond line thickness. Final settled thickness of the
	BLT	thermal interface material after installation of
		heatsink.
		Flip Chip Ball Grid Array. A ball grid array packaging
	FCBGA	technology where the die is exposed on the package
		substrate.
		The chipset component that integrates an Ultra ATA
		100 controller, six Serial ATA host controller ports,
		one EHCI host controller supporting eight external
	Intel® 6321ESB I/O Controller Hub	USB 2.0 ports, LPC interface controller, flash BIOS
		interface controller, PCI/PCI-X interface controller,
		PCI Express interface, BMC controller, Azalia / AC'97
		digital controller, integrated LAN controller, an ASF
		controller and a ESI for communication with the MCH.
		Linear Feet Per Minute. A measure of airflow emitted
	LFM	from a forced convection device, such as an axial fan
		or blower.
		Memory controller hub. The chipset component that
	MCH	contains the processor interface, the memory
		interface, and the South Bridge Interface.
		Maximum die temperature allowed. This temperature
	Tcase-max	is measured at the geometric center of the top of the
		package die.
		Minimum die temperature allowed. This temperature
	Tcase-min	is measured at the geometric center of the top of the
		package die.
		Thermal Design Power. Thermal solutions should be
	TDP	designed to dissipate this target power level. TDP is
		not the maximum power that the chipset can
		dissipate.
		Case-to-ambient thermal characterization parameter.
		A measure of the thermal solution thermal
		performance including the TIM using total package
	ΨCA	power. Defined as (TCASE – TLA) / Total Package
		Power.
		Note: Heat source must be specified when using Ψ
		calculations.
		Case-to-Sink thermal characterization parameter. A
		measure of the thermal interface material
	ΨCS	performance using total package power. Defined as
		(TCASE - TSINK)/ Total Package Power.
		Note: Heat source must be specified when using Ψ
		calculations.
		Sink-to-Ambient thermal characterization parameter.
		A measure of the heat sink performance using total
	ΨSA	package power. Defined as (TSINK - TLA)/Total
		Package Power.
		Note: Heat source must be specified when using Ψ
		calculations.

1.3	Reference Documents
	The reader of this specification should also be familiar with material and concepts
	presented in the following documents:
	Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007	TMDG
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