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Intel 632xESB, 631xESB manual Packaging Technology-Intel 6321ESB ICH

Models: 632xESB 631xESB

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Packaging Technology—Intel®6321ESB ICH

Packaging Technology—Intel®6321ESB ICH

2.0Packaging Technology

The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer FC-BGA3 package (see Figure 2 and Figure 3).

Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)

				Die
	Handling			Keepout
	Exclusion	19.49mm.		Area
	Area
	10.78mm.		6.17mm.
			6.17mm.
	20.19mm. 13.99mm.	ESB2	26.0mm.	30.0mm.	40.0mm.
	20.19mm. 13.99mm.	Die	26.0mm.	30.0mm.	40.0mm.
		Die
	3.10mm.
		26.0mm.
		30.0mm.
		40.0mm.

Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)

	Substrate	Decoup
	2.535 ± 0.123 mm	Decoup		Die
	2.535 ± 0.123 mm	Cap
			0.84 ± 0.05 mm
	2.100 ± 0.121 mm			0.7 mm Max	0.20 See note 4.
	2.100 ± 0.121 mm			0.7 mm Max	0.20 See note 4.
					0.20 –C–
	0.435 ± 0.025 mm			Seating Plane
	0.435 ± 0.025 mm				See note 1.
	See note 3				See note 1.
	Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 9

Image 9

Intel 632xESB, 631xESB manual Packaging Technology-Intel 6321ESB ICH

Contents

Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications Thermal and Mechanical Design GuidelinesFebruary Order NumberTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsContents FiguresIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionStep 1 Thermal Figure 1. Thermal Design ProcessSimulation Thermal ModelReference Documents 1.2 Definition of TermsDefinition of Terms Introduction-Intel 6321ESB ICHIntel 6321ESB ICH-Introduction Referenced DocumentsTitle LocationPackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.1 Thermal Design Power TDP 3.0 Thermal SpecificationsTable 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.2 Die Case TemperatureIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal Simulation5.1 Characterizing the Thermal Solution Requirement 5.0 Thermal Solution RequirementsΨCA = TCASE - TLAExample 1. Calculating the Required Thermal Performance Figure 5. Processor Thermal Characterization Parameter RelationshipsΨCA = TCASE - TLAT C - T LA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WTable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Thermocouple Wire Figure 8. Zero Degree Angle Attach Methodology Top ViewDie Substrate Cement + Thermocouple Bead7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance 2.3 sigma 7.3 Mechanical Design Envelopeplus ca meanESB2 7.4 Board-Level Components Keepout DimensionsHeatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH 7.5.2 Mechanical Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC Reliability Guidelines 8.0 Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestA.1 Torsional Clip Heatsink Thermal Solution Appendix A Thermal Solution Component SuppliersThermal Solution Component Suppliers-Intel 6321ESB ICH PartMechanical Drawing List Appendix B Mechanical DrawingsTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing