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Intel 631xESB, 632xESB manual Intel 6321ESB ICH-Thermal Simulation

Models: 632xESB 631xESB

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Intel® 6321ESB ICH—Thermal Simulation

4.0Thermal Simulation

Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by Flomerics, Inc*. These models are also available in IcePak* format. Contact your Intel field sales representative to order the thermal models and user's guides.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 12

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Intel 631xESB, 632xESB manual Intel 6321ESB ICH-Thermal Simulation

Contents

Thermal and Mechanical Design Guidelines Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFebruary Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Contents FiguresIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowFigure 1. Thermal Design Process Step 1 ThermalSimulation Thermal Model1.2 Definition of Terms Reference DocumentsDefinition of Terms Introduction-Intel 6321ESB ICHReferenced Documents Intel 6321ESB ICH-IntroductionTitle Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.0 Thermal Specifications 3.1 Thermal Design Power TDPTable 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.2 Die Case Temperature4.0 Thermal Simulation Intel 6321ESB ICH-Thermal Simulation5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution RequirementΨCA = TCASE - TLAFigure 5. Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceΨCA = TCASE - TLAC ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W T C - T LATable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Figure 8. Zero Degree Angle Attach Methodology Top View Thermocouple WireDie Substrate Cement + Thermocouple Bead7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance 7.3 Mechanical Design Envelope 2.3 sigmaplus ca mean7.4 Board-Level Components Keepout Dimensions ESB2Heatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH Figure 12. Torsional Clip Heatsink Assembly 7.5.2 Mechanical Interface Material7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC 8.0 Reliability Guidelines Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestAppendix A Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionThermal Solution Component Suppliers-Intel 6321ESB ICH PartAppendix B Mechanical Drawings Mechanical Drawing ListTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings