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Intel 631xESB, 632xESB manual Torsional Clip Drawing, Intel 6321ESB ICH-Mechanical Drawings

Models: 632xESB 631xESB

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Figure 16. Torsional Clip Drawing

Intel® 6321ESB ICH—Mechanical Drawings

Figure 16. Torsional Clip Drawing

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 32

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Intel 631xESB, 632xESB manual Torsional Clip Drawing, Intel 6321ESB ICH-Mechanical Drawings

Contents

Thermal and Mechanical Design Guidelines Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFebruary Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Introduction ContentsFigures Revision History Tables1.0 Introduction 1.1 Design FlowFigure 1. Thermal Design Process Step 1 ThermalSimulation Thermal Model1.2 Definition of Terms Reference DocumentsDefinition of Terms Introduction-Intel 6321ESB ICHReferenced Documents Intel 6321ESB ICH-IntroductionTitle Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.0 Thermal Specifications 3.1 Thermal Design Power TDPTable 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.2 Die Case Temperature4.0 Thermal Simulation Intel 6321ESB ICH-Thermal Simulation5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution RequirementΨCA = TCASE - TLAFigure 5. Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceΨCA = TCASE - TLAC ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W T C - T LATable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1.1 Zero Degree Angle Attach Methodology 6.0 Thermal Metrology6.1 Die Case Temperature Measurements Thermal Metrology-Intel 6321ESB ICH Figure 6. Thermal Solution Decision FlowchartFigure 7. Zero Degree Angle Attach Heatsink Modifications Figure 8. Zero Degree Angle Attach Methodology Top View Thermocouple WireDie Substrate Cement + Thermocouple Bead7.2 Heatsink Performance 7.0 Reference Thermal Solution7.1 Operating Environment 7.3 Mechanical Design Envelope 2.3 sigmaplus ca mean7.4 Board-Level Components Keepout Dimensions ESB2Heatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Reference Thermal Solution-Intel 6321ESB ICH 7.5.1 Heatsink OrientationFigure 11. Torsional Clip Heatsink Board Component Keepout Figure 12. Torsional Clip Heatsink Assembly 7.5.2 Mechanical Interface Material7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM PerformanceAll measured at 50ºC 7.5.4 Heatsink Clip7.5.5 Clip Retention Anchors 8.0 Reliability Guidelines Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestAppendix A Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionThermal Solution Component Suppliers-Intel 6321ESB ICH PartAppendix B Mechanical Drawings Mechanical Drawing ListTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings