Manuals / Intel / Computer Equipment / Computer Hardware

Intel 631xESB, 632xESB manual Mechanical Interface Material, Thermal Interface Material

Models: 632xESB 631xESB

1 32

Download 32 pages 49.34 Kb

Page 24

Figure 12. Torsional Clip Heatsink Assembly

Intel® 6321ESB ICH—Reference Thermal Solution

Figure 12. Torsional Clip Heatsink Assembly

7.5.2Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.3Thermal Interface Material

A Thermal Interface Material (TIM) provides improved conductivity between the die and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010 in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.

Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.

7.5.3.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F TIM is shown in Table 5.

Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/ 632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of Line value represents the TIM performance post heatsink assembly while the End of

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 24

Image 24

Intel 631xESB, 632xESB manual Mechanical Interface Material, Thermal Interface Material, Torsional Clip Heatsink Assembly

Contents

Thermal and Mechanical Design Guidelines Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFebruary Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Contents FiguresIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowFigure 1. Thermal Design Process Step 1 ThermalSimulation Thermal Model1.2 Definition of Terms Reference DocumentsDefinition of Terms Introduction-Intel 6321ESB ICHReferenced Documents Intel 6321ESB ICH-IntroductionTitle Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.0 Thermal Specifications 3.1 Thermal Design Power TDP3.2 Die Case Temperature Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications4.0 Thermal Simulation Intel 6321ESB ICH-Thermal Simulation5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution RequirementΨCA = TCASE - TLAFigure 5. Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceΨCA = TCASE - TLAC ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W T C - T LATable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Figure 8. Zero Degree Angle Attach Methodology Top View Thermocouple WireDie Substrate Cement + Thermocouple Bead7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance 7.3 Mechanical Design Envelope 2.3 sigmaplus ca mean7.4 Board-Level Components Keepout Dimensions ESB2Heatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH Figure 12. Torsional Clip Heatsink Assembly 7.5.2 Mechanical Interface Material7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC 8.0 Reliability Guidelines Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestAppendix A Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionThermal Solution Component Suppliers-Intel 6321ESB ICH PartAppendix B Mechanical Drawings Mechanical Drawing ListTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings