Torsional Clip Heatsink Thermal Solution Assembly | Intel 631xESB

Intel® 6321ESB ICH—Reference Thermal Solution

7.5Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the Intel® 6321ESB ICH component is a passive heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 12 shows the reference thermal solution assembly and associated components. The torsional clip and the clip retention anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100 chipset reference thermal solutions.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanical Drawings”. Appendix A, “Thermal Solution Component Suppliers” contains vendor information for each thermal solution component.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

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Intel 631xESB, 632xESB manual Torsional Clip Heatsink Thermal Solution Assembly

Contents

Thermal and Mechanical Design Guidelines FebruaryPage Contents Date Revision Description Revision HistoryTables 001 Initial public release Introduction Design Flow Thermal Design Process Definition of Terms Definition of TermsReference Documents Term Definition Referenced Documents Title Location Intel 6321ESB I/O Controller Hub Package Dimensions Top View Packaging Technology Intel 6321ESB ICH-Packaging Technology Die Case Temperature Thermal SpecificationsThermal Design Power TDP Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal Simulation Thermal Solution Requirements Characterizing the Thermal Solution Requirement Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance Device CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Required Heat Sink Thermal Performance ΨCAHub @ 12.4 W Thermal Metrology Die Case Temperature MeasurementsZero Degree Angle Attach Methodology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Operating Environment Reference Thermal SolutionHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Heatsink Orientation Torsional Clip Heatsink Board Component Keepout Mechanical Interface Material Thermal Interface Material Thermal Resistance C × in 2/W Heatsink ClipClip Retention Anchors Pressure on IHSpsi End of Line End of Life Reliability Guidelines Reliability Guidelines§ § Test Requirement Pass/Fail Criteria Appendix a Thermal Solution Component Suppliers Torsional Clip Heatsink Thermal Solution Mechanical Drawing List Appendix B Mechanical DrawingsDrawing Description Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing