Manuals / Intel / Computer Equipment / Computer Hardware

Intel 631xESB, 632xESB manual Torsional Clip Heatsink Thermal Solution Assembly

Models: 632xESB 631xESB

1 32

Download 32 pages 49.34 Kb

Page 22

Image 22

Intel® 6321ESB ICH—Reference Thermal Solution

7.5Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the Intel® 6321ESB ICH component is a passive heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 12 shows the reference thermal solution assembly and associated components. The torsional clip and the clip retention anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100 chipset reference thermal solutions.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanical Drawings”. Appendix A, “Thermal Solution Component Suppliers” contains vendor information for each thermal solution component.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 22

Page 22

Image 22

Intel 631xESB, 632xESB manual Torsional Clip Heatsink Thermal Solution Assembly

Contents

February Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Figures ContentsIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowSimulation Figure 1. Thermal Design ProcessStep 1 Thermal Thermal ModelDefinition of Terms 1.2 Definition of TermsReference Documents Introduction-Intel 6321ESB ICHTitle Referenced DocumentsIntel 6321ESB ICH-Introduction Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.2 Die Case Temperature 3.0 Thermal Specifications3.1 Thermal Design Power TDP Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications4.0 Thermal Simulation Intel 6321ESB ICH-Thermal SimulationΨCA = 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement TCASE - TLAΨCA = Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance TCASE - TLATable 4. Required Heat Sink Thermal Performance ΨCA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA ΨCA =6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Die Substrate Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Cement + Thermocouple Bead7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance plus 7.3 Mechanical Design Envelope2.3 sigma ca meanHeatsink 7.4 Board-Level Components Keepout DimensionsESB2 Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH 7.5.3 Thermal Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC Intel 6321ESB ICH-Reliability Guidelines 8.0 Reliability GuidelinesReliability Guidelines TestThermal Solution Component Suppliers-Intel 6321ESB ICH Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution PartTable 7 lists the mechanical drawings included in this appendix Appendix B Mechanical DrawingsMechanical Drawing List Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings