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Intel 631xESB, 632xESB manual Revision History, Tables

Models: 632xESB 631xESB

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Tables

Intel® 6321ESB ICH—Revision History

15	Heat Sink Foam Gasket Drawing	31
16	Torsional Clip Drawing	32
Tables
1	Definition of Terms	7
2	Referenced Documents	8
3	Intel® 6321ESB I/O Controller Hub Thermal Specifications	11
4	Required Heat Sink Thermal Performance (YCA)	15
5	Honeywell PCM45 F TIM Performance as a Function of Attach Pressure	25
6	Reliability Guidelines	26
7	Mechanical Drawing List	28

Revision History

Date	Revision	Description

February 2007	001	Initial public release.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 4

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Intel 631xESB, 632xESB manual Revision History, Tables

Contents

Thermal and Mechanical Design Guidelines Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFebruary Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Figures ContentsIntroduction Revision History Tables1.0 Introduction 1.1 Design FlowFigure 1. Thermal Design Process Step 1 ThermalSimulation Thermal Model1.2 Definition of Terms Reference DocumentsDefinition of Terms Introduction-Intel 6321ESB ICHReferenced Documents Intel 6321ESB ICH-IntroductionTitle Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology 3.0 Thermal Specifications 3.1 Thermal Design Power TDP3.2 Die Case Temperature Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications4.0 Thermal Simulation Intel 6321ESB ICH-Thermal Simulation5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution RequirementΨCA = TCASE - TLAFigure 5. Processor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal PerformanceΨCA = TCASE - TLAC ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W T C - T LATable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Figure 8. Zero Degree Angle Attach Methodology Top View Thermocouple WireDie Substrate Cement + Thermocouple Bead7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance 7.3 Mechanical Design Envelope 2.3 sigmaplus ca mean7.4 Board-Level Components Keepout Dimensions ESB2Heatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH Figure 12. Torsional Clip Heatsink Assembly 7.5.2 Mechanical Interface Material7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC 8.0 Reliability Guidelines Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestAppendix A Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionThermal Solution Component Suppliers-Intel 6321ESB ICH PartAppendix B Mechanical Drawings Mechanical Drawing ListTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings