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Intel 631xESB Intel 6321ESB ICH-Reliability Guidelines, Test, Requirement, Pass/Fail Criteria

Models: 632xESB 631xESB

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Intel® 6321ESB ICH—Reliability Guidelines

Intel® 6321ESB ICH—Reliability Guidelines

8.0Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6.

Table 6.	Reliability Guidelines

	Test (1)	Requirement	Pass/Fail Criteria (2)

	Mechanical Shock	50 g, board level, 11 msec, 3 shocks/axis	Visual Check and Electrical Functional Test

	Random Vibration	7.3 g, board level, 45 min/axis, 50 Hz to	Visual Check and Electrical Functional Test
	Random Vibration	2000 Hz	Visual Check and Electrical Functional Test
		2000 Hz

	Temperature Life	85°C, 2000 hours total, checkpoints at	Visual Check
	Temperature Life	168, 500, 1000, and 2000 hours	Visual Check
		168, 500, 1000, and 2000 hours

	Thermal Cycling	-5°C to +70°C, 500 cycles	Visual Check

	Humidity	85% relative humidity, 55°C, 1000 hours	Visual Check

Notes:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 26

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Intel 631xESB, 632xESB manual Intel 6321ESB ICH-Reliability Guidelines, Test, Requirement, Pass/Fail Criteria

Contents

February Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications Order NumberIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDGFebruary 2007Introduction ContentsFigures Revision History Tables1.0 Introduction 1.1 Design FlowSimulation Figure 1. Thermal Design ProcessStep 1 Thermal Thermal ModelDefinition of Terms 1.2 Definition of TermsReference Documents Introduction-Intel 6321ESB ICHTitle Referenced DocumentsIntel 6321ESB ICH-Introduction Location2.0 Packaging Technology Packaging Technology-Intel 6321ESB ICHIntel 6321ESB ICH-Packaging Technology Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.0 Thermal Specifications3.1 Thermal Design Power TDP 3.2 Die Case Temperature4.0 Thermal Simulation Intel 6321ESB ICH-Thermal SimulationΨCA = 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement TCASE - TLAΨCA = Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance TCASE - TLATable 4. Required Heat Sink Thermal Performance ΨCA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA ΨCA =6.1.1 Zero Degree Angle Attach Methodology 6.0 Thermal Metrology6.1 Die Case Temperature Measurements Thermal Metrology-Intel 6321ESB ICH Figure 6. Thermal Solution Decision FlowchartFigure 7. Zero Degree Angle Attach Heatsink Modifications Die Substrate Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Cement + Thermocouple Bead7.2 Heatsink Performance 7.0 Reference Thermal Solution7.1 Operating Environment plus 7.3 Mechanical Design Envelope2.3 sigma ca meanHeatsink 7.4 Board-Level Components Keepout DimensionsESB2 Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Reference Thermal Solution-Intel 6321ESB ICH 7.5.1 Heatsink OrientationFigure 11. Torsional Clip Heatsink Board Component Keepout 7.5.3 Thermal Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3.1 Effect of Pressure on TIM PerformanceAll measured at 50ºC 7.5.4 Heatsink Clip7.5.5 Clip Retention Anchors Intel 6321ESB ICH-Reliability Guidelines 8.0 Reliability GuidelinesReliability Guidelines TestThermal Solution Component Suppliers-Intel 6321ESB ICH Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution PartTable 7 lists the mechanical drawings included in this appendix Appendix B Mechanical DrawingsMechanical Drawing List Intel 6321ESB ICH-Mechanical DrawingsFigure 13. Torsional Clip Heatsink Assembly Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 14. Torsional Clip Heatsink Drawing Intel 6321ESB ICH-Mechanical DrawingsFigure 15. Heat Sink Foam Gasket Drawing Mechanical Drawings-Intel 6321ESB ICHFigure 16. Torsional Clip Drawing Intel 6321ESB ICH-Mechanical Drawings