Intel 631xESB, 632xESB manual Reliability Guidelines, § §, Test Requirement Pass/Fail Criteria

Intel® 6321ESB ICH—Reliability Guidelines

8.0Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6.

Table 6.	Reliability Guidelines
	Test (1)	Requirement	Pass/Fail Criteria (2)
	Mechanical Shock	50 g, board level, 11 msec, 3 shocks/axis	Visual Check and Electrical Functional Test
	Random Vibration	7.3 g, board level, 45 min/axis, 50 Hz to	Visual Check and Electrical Functional Test
		2000 Hz
	Temperature Life	85°C, 2000 hours total, checkpoints at	Visual Check
		168, 500, 1000, and 2000 hours
	Thermal Cycling	-5°C to +70°C, 500 cycles	Visual Check
	Humidity	85% relative humidity, 55°C, 1000 hours	Visual Check

Notes:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 26