Thermal Solution Component
Appendix A Thermal Solution Component Suppliers
A.1 Torsional Clip Heatsink Thermal Solution
Part | Intel Part | Supplier | Contact Information | |
Number | (Part Number) | |||
|
| |||
|
|
|
| |
AdvancedTCA* and |
| Wendy Lin | ||
Embedded Form Factor Heat | N/A | |||
(Aluminum) | ||||
Sink |
| Wendy@coolermaster.com | ||
|
| |||
|
|
|
| |
Thermal Interface |
| Honeywell* | Paula Knoll | |
N/A | ||||
(PCM45F) | PCM45F | |||
| paula.knoll@honeywell.com | |||
|
|
| ||
|
|
|
| |
|
|
| Harry Lin (USA) | |
|
|
| ||
Heatsink Attach Clip | CCI/ACK | hlinack@aol.com | ||
Monica Chih (Taiwan) | ||||
|
|
| ||
|
|
| ||
|
|
| monica_chih@ccic.com.tw | |
|
|
|
| |
|
|
| Bob Hall (USA) | |
Heat Sink Attach Clip | Foxconn* | |||
|
|
| bhall@foxconn.com | |
|
|
|
| |
|
| Foxconn | Julia Jiang (USA) | |
|
| juliaj@foxconn.com | ||
|
|
| ||
|
|
|
|
Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007TMDG 27
