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Intel 632xESB, 631xESB Appendix A Thermal Solution Component Suppliers, Intel Part, Number

Models: 632xESB 631xESB

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Thermal Solution Component Suppliers—Intel®6321ESB ICH

Thermal Solution Component Suppliers—Intel®6321ESB ICH

Appendix A Thermal Solution Component Suppliers

A.1 Torsional Clip Heatsink Thermal Solution

	Part	Intel Part	Supplier	Contact Information
	Part	Number	(Part Number)	Contact Information
		Number	(Part Number)

	AdvancedTCA* and		ECB-00306-01-GP	Wendy Lin
	Embedded Form Factor Heat	N/A	ECB-00306-01-GP	510-770-8566, x211
	Embedded Form Factor Heat	N/A	(Aluminum)	510-770-8566, x211
	Sink		(Aluminum)	Wendy@coolermaster.com
	Sink			Wendy@coolermaster.com

	Thermal Interface		Honeywell*	Paula Knoll
	Thermal Interface	N/A	Honeywell*	858-705-1274
	(PCM45F)	N/A	PCM45F	858-705-1274
	(PCM45F)		PCM45F	paula.knoll@honeywell.com
				paula.knoll@honeywell.com

				Harry Lin (USA)
				714-739-5797
	Heatsink Attach Clip	A69230-001	CCI/ACK	hlinack@aol.com
	Heatsink Attach Clip	A69230-001	CCI/ACK	Monica Chih (Taiwan)
				Monica Chih (Taiwan)
				866-2-29952666, x131
				monica_chih@ccic.com.tw

				Bob Hall (USA)
	Heat Sink Attach Clip	A69230-001	Foxconn*	503-693-3509, x235
				bhall@foxconn.com

			Foxconn	Julia Jiang (USA)
	Solder-Down Anchor	A13494-005	Foxconn	408-919-6178
	Solder-Down Anchor	A13494-005	(HB96030-DW)	408-919-6178
			(HB96030-DW)	juliaj@foxconn.com
				juliaj@foxconn.com

Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 27

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Intel 632xESB Appendix A Thermal Solution Component Suppliers, A.1 Torsional Clip Heatsink Thermal Solution, Part, Number

Contents

Order Number Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications FebruaryTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsContents FiguresIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionThermal Model Figure 1. Thermal Design ProcessStep 1 Thermal SimulationIntroduction-Intel 6321ESB ICH 1.2 Definition of TermsReference Documents Definition of TermsLocation Referenced DocumentsIntel 6321ESB ICH-Introduction TitlePackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.0 Thermal Specifications3.1 Thermal Design Power TDP 3.2 Die Case TemperatureIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal SimulationTCASE - TLA 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement ΨCA =TCASE - TLA Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance ΨCA =ΨCA = C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA Table 4. Required Heat Sink Thermal Performance ΨCA6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Cement + Thermocouple Bead Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Die Substrate7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance ca mean 7.3 Mechanical Design Envelope2.3 sigma plusMotherboard 7.4 Board-Level Components Keepout DimensionsESB2 Heatsink7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH 7.5.3.1 Effect of Pressure on TIM Performance Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3 Thermal Interface Material7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC Test 8.0 Reliability GuidelinesReliability Guidelines Intel 6321ESB ICH-Reliability GuidelinesPart Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution Thermal Solution Component Suppliers-Intel 6321ESB ICHIntel 6321ESB ICH-Mechanical Drawings Appendix B Mechanical DrawingsMechanical Drawing List Table 7 lists the mechanical drawings included in this appendixMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing