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Intel 632xESB, 631xESB manual Heat Sink Foam Gasket Drawing, Mechanical Drawings-Intel 6321ESB ICH

Models: 632xESB 631xESB

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Mechanical Drawings—Intel®6321ESB ICH

Figure 15. Heat Sink Foam Gasket Drawing

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 31

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Intel 632xESB, 631xESB manual Heat Sink Foam Gasket Drawing, Mechanical Drawings-Intel 6321ESB ICH

Contents

Order Number Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications FebruaryTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFigures ContentsIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionThermal Model Figure 1. Thermal Design ProcessStep 1 Thermal SimulationIntroduction-Intel 6321ESB ICH 1.2 Definition of TermsReference Documents Definition of TermsLocation Referenced DocumentsIntel 6321ESB ICH-Introduction TitlePackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.2 Die Case Temperature 3.0 Thermal Specifications3.1 Thermal Design Power TDP Table 3. Intel 6321ESB I/O Controller Hub Thermal SpecificationsIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal SimulationTCASE - TLA 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement ΨCA =TCASE - TLA Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance ΨCA =ΨCA = C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA Table 4. Required Heat Sink Thermal Performance ΨCA6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Cement + Thermocouple Bead Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Die Substrate7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance ca mean 7.3 Mechanical Design Envelope2.3 sigma plusMotherboard 7.4 Board-Level Components Keepout DimensionsESB2 Heatsink7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH 7.5.3.1 Effect of Pressure on TIM Performance Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3 Thermal Interface Material7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC Test 8.0 Reliability GuidelinesReliability Guidelines Intel 6321ESB ICH-Reliability GuidelinesPart Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution Thermal Solution Component Suppliers-Intel 6321ESB ICHIntel 6321ESB ICH-Mechanical Drawings Appendix B Mechanical DrawingsMechanical Drawing List Table 7 lists the mechanical drawings included in this appendixMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing