Intel 631xESB, 632xESB manual Intel 6321ESB ICH-Packaging Technology

Intel® 6321ESB ICH—Packaging Technology

Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)

AT	A
AP	R
	A
AM N
AK	AL
A	AJ
H	AG
AF
A	AE
D	A
AB	C
Y	AA																					40 + 0.05
																						- A -
	W
V
T	U
P	R
M	N
K	L
19.11	J
H
F	G
	E
35X 1.092	C
B
	A
		2	4	6		8	10	12	14	16		18	20	22	24	26	28	30	32	34	36	A
	1	3	5		7	9		11	13	15	17	19	21	23	25	27	29	31		33	35
			35X
			1.092
						19.11
											40 + 0.05											B
												0.2	C	A

Notes:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

3.Package Mechanical Requirements

The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes:

1.The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/ IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

TMDGFebruary 2007 10