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Intel 632xESB, 631xESB Thermal Solution Decision Flowchart, Thermal Metrology-Intel 6321ESB ICH

Models: 632xESB 631xESB

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Image 17

Thermal Metrology—Intel®6321ESB ICH

Figure 6. Thermal Solution Decision Flowchart

Start
	Attach
Attach device	thermocouples	Run the Power
to board	using recommended	program and	Tdie >
using normal	metrology. Setup	monitor the	Tdie >	No
using normal	metrology. Setup	monitor the	Specification?	No
reflow	the system in the	device die	Specification?
reflow	the system in the	device die
process.	desired	temperature.
	configuration.			End
				End
	Select	Heatsink	Yes
	Heatsink	Required	Yes
	Heatsink	Required
				001240

Figure 7. Zero Degree Angle Attach Heatsink Modifications

Note: Not to scale.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 17

Page 17

Image 17

Intel 632xESB, 631xESB manual Thermal Solution Decision Flowchart, Zero Degree Angle Attach Heatsink Modifications

Contents

Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications Thermal and Mechanical Design GuidelinesFebruary Order NumberTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsIntroduction ContentsFigures Tables Revision History1.1 Design Flow 1.0 IntroductionStep 1 Thermal Figure 1. Thermal Design ProcessSimulation Thermal ModelReference Documents 1.2 Definition of TermsDefinition of Terms Introduction-Intel 6321ESB ICHIntel 6321ESB ICH-Introduction Referenced DocumentsTitle LocationPackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.1 Thermal Design Power TDP 3.0 Thermal Specifications3.2 Die Case Temperature Table 3. Intel 6321ESB I/O Controller Hub Thermal SpecificationsIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal Simulation5.1 Characterizing the Thermal Solution Requirement 5.0 Thermal Solution RequirementsΨCA = TCASE - TLAExample 1. Calculating the Required Thermal Performance Figure 5. Processor Thermal Characterization Parameter RelationshipsΨCA = TCASE - TLAT C - T LA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WTable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1.1 Zero Degree Angle Attach Methodology 6.1 Die Case Temperature Measurements6.0 Thermal Metrology Thermal Metrology-Intel 6321ESB ICH Figure 6. Thermal Solution Decision FlowchartFigure 7. Zero Degree Angle Attach Heatsink Modifications Thermocouple Wire Figure 8. Zero Degree Angle Attach Methodology Top ViewDie Substrate Cement + Thermocouple Bead7.2 Heatsink Performance 7.0 Reference Thermal Solution7.1 Operating Environment 2.3 sigma 7.3 Mechanical Design Envelopeplus ca meanESB2 7.4 Board-Level Components Keepout DimensionsHeatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Reference Thermal Solution-Intel 6321ESB ICH 7.5.1 Heatsink OrientationFigure 11. Torsional Clip Heatsink Board Component Keepout 7.5.2 Mechanical Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM PerformanceAll measured at 50ºC 7.5.4 Heatsink Clip7.5.5 Clip Retention Anchors Reliability Guidelines 8.0 Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestA.1 Torsional Clip Heatsink Thermal Solution Appendix A Thermal Solution Component SuppliersThermal Solution Component Suppliers-Intel 6321ESB ICH PartMechanical Drawing List Appendix B Mechanical DrawingsTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing