Thermal Solution Decision Flowchart | Intel 632xESB, 631xESB

Thermal Metrology—Intel®6321ESB ICH

Figure 6. Thermal Solution Decision Flowchart

	Start
		Attach
	Attach device	thermocouples	Run the Power
	to board	using recommended	program and	Tdie >
	using normal	metrology. Setup	monitor the	Tdie >	No
	using normal	metrology. Setup	monitor the	Specification?	No
	reflow	the system in the	device die	Specification?
	reflow	the system in the	device die
	process.	desired	temperature.
		configuration.			End
					End
		Select	Heatsink	Yes
		Heatsink	Required	Yes
		Heatsink	Required
					001240

Figure 7. Zero Degree Angle Attach Heatsink Modifications

Note: Not to scale.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 17

Image 17

Intel 632xESB, 631xESB manual Thermal Solution Decision Flowchart

Contents

February Thermal and Mechanical Design GuidelinesPage Contents Tables Revision HistoryDate Revision Description 001 Initial public release Design Flow Introduction Thermal Design Process Reference Documents Definition of TermsDefinition of Terms Term Definition Title Location Referenced Documents Packaging Technology Intel 6321ESB I/O Controller Hub Package Dimensions Top View Intel 6321ESB ICH-Packaging Technology Thermal Design Power TDP Thermal SpecificationsDie Case Temperature Intel 6321ESB I/O Controller Hub Thermal Specifications Thermal Simulation Characterizing the Thermal Solution Requirement Thermal Solution Requirements Example 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships Hub @ 12.4 W Required Heat Sink Thermal Performance ΨCADevice CA º C/W at T LA = 45º C CA º C/W at T LA = 65º C Zero Degree Angle Attach Methodology Die Case Temperature MeasurementsThermal Metrology Thermal Solution Decision Flowchart Thermocouple Wire Die Substrate Cement + Thermocouple Bead Heatsink Performance Reference Thermal SolutionOperating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution Assembly Torsional Clip Heatsink Board Component Keepout Heatsink Orientation Thermal Interface Material Mechanical Interface Material Clip Retention Anchors Heatsink ClipThermal Resistance C × in 2/W Pressure on IHSpsi End of Line End of Life § § Reliability GuidelinesReliability Guidelines Test Requirement Pass/Fail Criteria Torsional Clip Heatsink Thermal Solution Appendix a Thermal Solution Component Suppliers Drawing Description Appendix B Mechanical DrawingsMechanical Drawing List Torsional Clip Heatsink Assembly Drawing Torsional Clip Heatsink Drawing Heat Sink Foam Gasket Drawing Torsional Clip Drawing