Reference Thermal Solution—Intel®6321ESB ICH

Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line thermal resistance of 0.345 °C x in2/W and End of Life thermal resistance of 0.459°C in2/W.

Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure

 

 

Thermal Resistance (°C × in2)/W

Pressure on IHS(psi)

 

 

 

 

End of Line End of Life

End of Line End of Life

 

 

 

 

2.18

 

0.391

0.551

 

 

 

 

4.35

 

0.345

0.459

 

 

 

 

Note:

All measured at 50ºC.

 

7.5.4Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a mechanical drawing of the clip.

7.5.5Clip Retention Anchors

For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A, “Thermal Solution Component Suppliers” for the part number and supplier information.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 25

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Intel 632xESB, 631xESB manual Heatsink Clip, Clip Retention Anchors, Thermal Resistance C × in 2/W