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Intel 632xESB, 631xESB manual Heatsink Clip, Clip Retention Anchors, All measured at 50ºC

Models: 632xESB 631xESB

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Reference Thermal Solution—Intel®6321ESB ICH

Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line thermal resistance of 0.345 °C x in2/W and End of Life thermal resistance of 0.459°C in2/W.

Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure

		Thermal Resistance (°C × in2)/W
Pressure on IHS(psi)
		End of Line End of Life	End of Line End of Life

2.18		0.391	0.551

4.35		0.345	0.459

Note:	All measured at 50ºC.

7.5.4Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a mechanical drawing of the clip.

7.5.5Clip Retention Anchors

For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A, “Thermal Solution Component Suppliers” for the part number and supplier information.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 25

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Intel 632xESB, 631xESB manual Heatsink Clip, Clip Retention Anchors, All measured at 50ºC

Contents

Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications Thermal and Mechanical Design GuidelinesFebruary Order NumberTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFigures ContentsIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionStep 1 Thermal Figure 1. Thermal Design ProcessSimulation Thermal ModelReference Documents 1.2 Definition of TermsDefinition of Terms Introduction-Intel 6321ESB ICHIntel 6321ESB ICH-Introduction Referenced DocumentsTitle LocationPackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.1 Thermal Design Power TDP 3.0 Thermal Specifications3.2 Die Case Temperature Table 3. Intel 6321ESB I/O Controller Hub Thermal SpecificationsIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal Simulation5.1 Characterizing the Thermal Solution Requirement 5.0 Thermal Solution RequirementsΨCA = TCASE - TLAExample 1. Calculating the Required Thermal Performance Figure 5. Processor Thermal Characterization Parameter RelationshipsΨCA = TCASE - TLAT C - T LA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WTable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Thermocouple Wire Figure 8. Zero Degree Angle Attach Methodology Top ViewDie Substrate Cement + Thermocouple Bead7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance 2.3 sigma 7.3 Mechanical Design Envelopeplus ca meanESB2 7.4 Board-Level Components Keepout DimensionsHeatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH 7.5.2 Mechanical Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC Reliability Guidelines 8.0 Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestA.1 Torsional Clip Heatsink Thermal Solution Appendix A Thermal Solution Component SuppliersThermal Solution Component Suppliers-Intel 6321ESB ICH PartMechanical Drawing List Appendix B Mechanical DrawingsTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing