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Intel 632xESB Board-Level Components Keepout Dimensions, ESB2, Heatsink, Motherboard, Passive

Models: 632xESB 631xESB

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Reference Thermal Solution—Intel®6321ESB ICH

Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub

ESB2		mm
		mm
Passive		mm.
Passive	4..2.3030mm61 m.	33.
Heatsink		33.
Heatsink		21.
		21.
		33.30
	4
Die + TIM
FCBGA + Solder Balls
Motherboard
42..30mm.
TNB
Heatsink
ESB2	mm
	mm
Passive	mm.
Passive	42.30 42.30
Heatsink	42.30 42.30

7.4Board-Level Components Keepout Dimensions

The location of holes pattern and keepout zones for the reference thermal solution are shown in Figure 11. This reference thermal solution has the same mounting hole pattern as that of the Intel® E7500/E7501/E7505 chipset.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 21

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Intel 632xESB, 631xESB manual Board-Level Components Keepout Dimensions, ESB2, Heatsink, Motherboard, Passive

Contents

Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications Thermal and Mechanical Design GuidelinesFebruary Order NumberTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsContents FiguresIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionStep 1 Thermal Figure 1. Thermal Design ProcessSimulation Thermal ModelReference Documents 1.2 Definition of TermsDefinition of Terms Introduction-Intel 6321ESB ICHIntel 6321ESB ICH-Introduction Referenced DocumentsTitle LocationPackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.1 Thermal Design Power TDP 3.0 Thermal Specifications3.2 Die Case Temperature Table 3. Intel 6321ESB I/O Controller Hub Thermal SpecificationsIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal Simulation5.1 Characterizing the Thermal Solution Requirement 5.0 Thermal Solution RequirementsΨCA = TCASE - TLAExample 1. Calculating the Required Thermal Performance Figure 5. Processor Thermal Characterization Parameter RelationshipsΨCA = TCASE - TLAT C - T LA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WTable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Thermocouple Wire Figure 8. Zero Degree Angle Attach Methodology Top ViewDie Substrate Cement + Thermocouple Bead7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance 2.3 sigma 7.3 Mechanical Design Envelopeplus ca meanESB2 7.4 Board-Level Components Keepout DimensionsHeatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH 7.5.2 Mechanical Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC Reliability Guidelines 8.0 Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestA.1 Torsional Clip Heatsink Thermal Solution Appendix A Thermal Solution Component SuppliersThermal Solution Component Suppliers-Intel 6321ESB ICH PartMechanical Drawing List Appendix B Mechanical DrawingsTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing