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Intel 632xESB Thermal Solution Requirements, Characterizing the Thermal Solution Requirement

Models: 632xESB 631xESB

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5.0Thermal Solution Requirements

Thermal Solution Requirements—Intel®6321ESB ICH

5.0Thermal Solution Requirements

5.1Characterizing the Thermal Solution Requirement

The idea of a “thermal characterization parameter” Ψ (the Greek letter psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). The thermal characterization parameter is calculated using total package power, whereas actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heat sink is difficult, since some of the power is dissipated via heat transfer into the package and board.

The case-to-local ambient thermal characterization parameter (ΨCA) is used as a measure of the thermal performance of the overall thermal solution. It is defined by Equation 1 and measured in units of °C/W.

Equation 1. Case-to-Local Ambient Thermal Characterization Parameter (ΨCA)

ΨCA =	TCASE – TLA
	----------TDP---------------

The case-to-local ambient thermal characterization parameter, ΨCA, is comprised of ΨCS, the thermal interface material (TIM) thermal characterization parameter, and of ΨSA, the sink-to-local ambient thermal characterization parameter:

Equation 2. Case-to-Local Ambient Thermal Characterization Parameter (ΨCA)

ΨCA = ΨCS + ΨSA

ΨCS is strongly dependent on the thermal conductivity and thickness of the TIM between the heat sink and device package.

ΨSA is a measure of the thermal characterization parameter from the bottom of the heat sink to the local ambient air. ΨSA is dependent on the heat sink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heat sink. Figure 5 illustrates the combination of the different thermal characterization parameters.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 13

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Intel 632xESB, 631xESB Thermal Solution Requirements, Characterizing the Thermal Solution Requirement, Ψca =, Tcase - Tla

Contents

Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications Thermal and Mechanical Design GuidelinesFebruary Order NumberTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsFigures ContentsIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionStep 1 Thermal Figure 1. Thermal Design ProcessSimulation Thermal ModelReference Documents 1.2 Definition of TermsDefinition of Terms Introduction-Intel 6321ESB ICHIntel 6321ESB ICH-Introduction Referenced DocumentsTitle LocationPackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.1 Thermal Design Power TDP 3.0 Thermal SpecificationsTable 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.2 Die Case TemperatureIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal Simulation5.1 Characterizing the Thermal Solution Requirement 5.0 Thermal Solution RequirementsΨCA = TCASE - TLAExample 1. Calculating the Required Thermal Performance Figure 5. Processor Thermal Characterization Parameter RelationshipsΨCA = TCASE - TLAT C - T LA C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WTable 4. Required Heat Sink Thermal Performance ΨCA ΨCA =6.1 Die Case Temperature Measurements 6.0 Thermal Metrology6.1.1 Zero Degree Angle Attach Methodology Figure 7. Zero Degree Angle Attach Heatsink Modifications Figure 6. Thermal Solution Decision FlowchartThermal Metrology-Intel 6321ESB ICH Thermocouple Wire Figure 8. Zero Degree Angle Attach Methodology Top ViewDie Substrate Cement + Thermocouple Bead7.1 Operating Environment 7.0 Reference Thermal Solution7.2 Heatsink Performance 2.3 sigma 7.3 Mechanical Design Envelopeplus ca meanESB2 7.4 Board-Level Components Keepout DimensionsHeatsink Motherboard7.5 Torsional Clip Heatsink Thermal Solution Assembly Figure 11. Torsional Clip Heatsink Board Component Keepout 7.5.1 Heatsink OrientationReference Thermal Solution-Intel 6321ESB ICH 7.5.2 Mechanical Interface Material Figure 12. Torsional Clip Heatsink Assembly7.5.3 Thermal Interface Material 7.5.3.1 Effect of Pressure on TIM Performance7.5.5 Clip Retention Anchors 7.5.4 Heatsink ClipAll measured at 50ºC Reliability Guidelines 8.0 Reliability GuidelinesIntel 6321ESB ICH-Reliability Guidelines TestA.1 Torsional Clip Heatsink Thermal Solution Appendix A Thermal Solution Component SuppliersThermal Solution Component Suppliers-Intel 6321ESB ICH PartMechanical Drawing List Appendix B Mechanical DrawingsTable 7 lists the mechanical drawings included in this appendix Intel 6321ESB ICH-Mechanical DrawingsMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing