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Intel 632xESB, 631xESB manual C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W, T C - T La, Ψca =, = 4.84 W

Models: 632xESB 631xESB

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Thermal Solution Requirements—Intel®6321ESB ICH

C ΨSA = ΨCA – ΨCS = 3.23 – 0.35 = 2.88°---

W

If the local ambient temperature is relaxed to 45° C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance:

ΨCA =	TC – TLA		105 – 45	C
ΨCA =	-----TDP------------	=	----12.4----------	= 4.84°W---

It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the case-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.

Table 4 summarizes the thermal budget required to adequately cool the Intel® 6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further calculations would need to be performed for different TDPs. Since the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.

Table 4. Required Heat Sink Thermal Performance (ΨCA)

	Device	ΨCA (º C/W) at TLA = 45º C	ΨCA (º C/W) at TLA = 65º C

	Intel® 6321ESB I/O Controller	4.84	3.23
	Hub @ 12.4 W	4.84	3.23
	Hub @ 12.4 W

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 15

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Intel 632xESB C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = W, T C - T La, Required Heat Sink Thermal Performance ΨCA, Ψca =, = 4.84 W

Contents

Order Number Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications FebruaryTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsContents FiguresIntroduction Tables Revision History1.1 Design Flow 1.0 IntroductionThermal Model Figure 1. Thermal Design ProcessStep 1 Thermal SimulationIntroduction-Intel 6321ESB ICH 1.2 Definition of TermsReference Documents Definition of TermsLocation Referenced DocumentsIntel 6321ESB ICH-Introduction TitlePackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology 3.2 Die Case Temperature 3.0 Thermal Specifications3.1 Thermal Design Power TDP Table 3. Intel 6321ESB I/O Controller Hub Thermal SpecificationsIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal SimulationTCASE - TLA 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement ΨCA =TCASE - TLA Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance ΨCA =ΨCA = C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA Table 4. Required Heat Sink Thermal Performance ΨCA6.0 Thermal Metrology 6.1 Die Case Temperature Measurements6.1.1 Zero Degree Angle Attach Methodology Figure 6. Thermal Solution Decision Flowchart Figure 7. Zero Degree Angle Attach Heatsink ModificationsThermal Metrology-Intel 6321ESB ICH Cement + Thermocouple Bead Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Die Substrate7.0 Reference Thermal Solution 7.1 Operating Environment7.2 Heatsink Performance ca mean 7.3 Mechanical Design Envelope2.3 sigma plusMotherboard 7.4 Board-Level Components Keepout DimensionsESB2 Heatsink7.5 Torsional Clip Heatsink Thermal Solution Assembly 7.5.1 Heatsink Orientation Figure 11. Torsional Clip Heatsink Board Component KeepoutReference Thermal Solution-Intel 6321ESB ICH 7.5.3.1 Effect of Pressure on TIM Performance Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3 Thermal Interface Material7.5.4 Heatsink Clip 7.5.5 Clip Retention AnchorsAll measured at 50ºC Test 8.0 Reliability GuidelinesReliability Guidelines Intel 6321ESB ICH-Reliability GuidelinesPart Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution Thermal Solution Component Suppliers-Intel 6321ESB ICHIntel 6321ESB ICH-Mechanical Drawings Appendix B Mechanical DrawingsMechanical Drawing List Table 7 lists the mechanical drawings included in this appendixMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing