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Intel 632xESB, 631xESB Thermal Specifications, Thermal Design Power TDP, Die Case Temperature

Models: 632xESB 631xESB

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3.0Thermal Specifications

Thermal Specifications—Intel®6321ESB ICH

3.0Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O Controller Hub component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel® 6321ESB I/O Controller Hub component.

3.2Die Case Temperature

To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub component, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 6.0 for guidelines on accurately measuring package die temperatures.

Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications

Parameter	Value	Notes

Tcase_max	105°C

Tcase_min	5°C

TDP	12.4W

Note: These specifications are based on silicon characterization; however, they may be updated as further data becomes available.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

February 2007TMDG 11

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Intel 632xESB, 631xESB manual Thermal Specifications, Thermal Design Power TDP, Die Case Temperature

Contents

Order Number Thermal and Mechanical Design GuidelinesIntel 631xESB/632xESB I/O Controller Hub for Embedded Applications FebruaryTMDGFebruary 2007 Intel 631xESB/632xESB I/O Controller Hub for Embedded ApplicationsIntroduction ContentsFigures Tables Revision History1.1 Design Flow 1.0 IntroductionThermal Model Figure 1. Thermal Design ProcessStep 1 Thermal SimulationIntroduction-Intel 6321ESB ICH 1.2 Definition of TermsReference Documents Definition of TermsLocation Referenced DocumentsIntel 6321ESB ICH-Introduction TitlePackaging Technology-Intel 6321ESB ICH 2.0 Packaging TechnologyIntel 6321ESB ICH-Packaging Technology Table 3. Intel 6321ESB I/O Controller Hub Thermal Specifications 3.0 Thermal Specifications3.1 Thermal Design Power TDP 3.2 Die Case TemperatureIntel 6321ESB ICH-Thermal Simulation 4.0 Thermal SimulationTCASE - TLA 5.0 Thermal Solution Requirements5.1 Characterizing the Thermal Solution Requirement ΨCA =TCASE - TLA Figure 5. Processor Thermal Characterization Parameter RelationshipsExample 1. Calculating the Required Thermal Performance ΨCA =ΨCA = C ΨSA = ΨCA - ΨCS = 3.23 - 0.35 = WT C - T LA Table 4. Required Heat Sink Thermal Performance ΨCA6.1.1 Zero Degree Angle Attach Methodology 6.1 Die Case Temperature Measurements6.0 Thermal Metrology Thermal Metrology-Intel 6321ESB ICH Figure 6. Thermal Solution Decision FlowchartFigure 7. Zero Degree Angle Attach Heatsink Modifications Cement + Thermocouple Bead Figure 8. Zero Degree Angle Attach Methodology Top ViewThermocouple Wire Die Substrate7.2 Heatsink Performance 7.0 Reference Thermal Solution7.1 Operating Environment ca mean 7.3 Mechanical Design Envelope2.3 sigma plusMotherboard 7.4 Board-Level Components Keepout DimensionsESB2 Heatsink7.5 Torsional Clip Heatsink Thermal Solution Assembly Reference Thermal Solution-Intel 6321ESB ICH 7.5.1 Heatsink OrientationFigure 11. Torsional Clip Heatsink Board Component Keepout 7.5.3.1 Effect of Pressure on TIM Performance Figure 12. Torsional Clip Heatsink Assembly7.5.2 Mechanical Interface Material 7.5.3 Thermal Interface MaterialAll measured at 50ºC 7.5.4 Heatsink Clip7.5.5 Clip Retention Anchors Test 8.0 Reliability GuidelinesReliability Guidelines Intel 6321ESB ICH-Reliability GuidelinesPart Appendix A Thermal Solution Component SuppliersA.1 Torsional Clip Heatsink Thermal Solution Thermal Solution Component Suppliers-Intel 6321ESB ICHIntel 6321ESB ICH-Mechanical Drawings Appendix B Mechanical DrawingsMechanical Drawing List Table 7 lists the mechanical drawings included in this appendixMechanical Drawings-Intel 6321ESB ICH Figure 13. Torsional Clip Heatsink Assembly DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 14. Torsional Clip Heatsink DrawingMechanical Drawings-Intel 6321ESB ICH Figure 15. Heat Sink Foam Gasket DrawingIntel 6321ESB ICH-Mechanical Drawings Figure 16. Torsional Clip Drawing