Motorola MVME197LE user manual Cooling Requirements

Models: MVME197LE

1 78
Download 78 pages 27.46 Kb
Page 18
Image 18

1

 

General Information

 

 

Table 1-1. MVME197LE Specifications (Continued)

 

 

 

 

 

 

 

 

 

 

Characteristics

Specifications

 

 

 

 

 

 

 

 

 

 

Physical dimensions:

Double-high VMEboard

 

 

PC board

 

 

 

Height

9.187 inches (233.35 mm)

 

 

Width

6.299 inches (160.00 mm)

 

 

Thickness

0.063 inch (1.60 mm)

 

 

PC board with connectors

 

 

 

and front panel

 

 

 

Height

10.309 inches (261.85 mm)

 

 

Width

7.4 inches (188.00 mm)

 

 

Thickness

0.80 inch (20.32 mm)

 

 

Board connectors:

 

 

 

P1 connector

A 96-pin connector which provides the interface to the

 

 

 

VMEbus signals.

 

 

P2 connector

A 96-pin connector which provides the interface to the

 

 

 

extended VMEbus signals and other I/O signals.

 

 

J1 connector

A 20-pin connector which provides the interface to the

 

 

 

remote reset, abort, the LEDs, and three general purpose I/O

 

 

 

signals.

 

 

J2 connector

A 249-pin connector which provides the interface to the

 

 

 

MC88110 address, data, and control signals to and from the

 

 

 

mezzanine expansion.

 

 

 

 

Cooling Requirements

The Motorola MVME197LE VMEmodule is specified, designed, and tested to operate reliably with an incoming air temperature range from 0° to 55° C (32° to 131° F) with forced air cooling at a velocity typically achievable by using a 100 CFM axial fan. Temperature qualification is performed in a standard Motorola VMEsystem 3000 chassis. Twenty-five watt load boards are inserted in two card slots, one on each side, adjacent to the board under test, to simulate a high power density system configuration. An assembly of three axial fans, rated at 100 CFM per fan, is placed directly under the VME card cage. The incoming air temperature is measured between the fan assembly and the card cage, where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated circuits are monitored to ensure component vendors specifications are not exceeded.

1-4

User’s Manual

Page 18
Image 18
Motorola MVME197LE user manual Cooling Requirements