Intel Itanium 2 Processor manual Overview, Processor Abstraction Layer

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1Introduction

1.1Overview

The Itanium 2 processor employs Explicitly Parallel Instruction Computing (EPIC) design concepts for a tighter coupling between hardware and software. In this design style, the interface between hardware and software is designed to enable the software to exploit all available compile- time information, and efficiently deliver this information to the hardware. It addresses several fundamental performance bottlenecks in modern computers, such as memory latency, memory address disambiguation, and control flow dependencies. The EPIC constructs provide powerful architectural semantics, and enable the software to make global optimizations across a large scheduling scope, thereby exposing available Instruction Level Parallelism (ILP) to the hardware. The hardware takes advantage of this enhanced ILP, and provides abundant execution resources. Additionally, it focuses on dynamic run-time optimizations to enable the compiled code schedule to flow at high throughput. This strategy increases the synergy between hardware and software, and leads to greater overall performance.

The Itanium 2 processor provides a 6-wide and 8-stage deep pipeline, running at up to 1.66 GHz. This provides a combination of abundant resources to exploit ILP as well as increased frequency for minimizing the latency of each instruction. The resources consist of six integer units, six multimedia units, two load and two store units, three branch units, two extended-precision floating point units, and one additional single-precision floating point unit. The hardware employs dynamic prefetch, branch prediction, a register scoreboard, and non-blocking caches to optimize for compile-time non-determinism. Three levels of on-die cache minimize overall memory latency. This includes up to a 9 MB L3 cache, accessed at core speed, providing up to 84.8 Gb/sec of data bandwidth. The system bus is designed to support up to four processors (on a single system bus), and can be used as an effective building block for very large systems. The balanced core and memory subsystem provide high performance for a wide range of applications ranging from commercial workloads to high performance technical computing.

The Itanium 2 processor supports a range of computing needs and configurations from a 2-way to large SMP servers. This document provides the electrical, mechanical and thermal specifications for the Itanium 2 processor for use while using systems with Itanium 2 processors.

1.2Processor Abstraction Layer

The Itanium 2 processor requires implementation-specific Processor Abstraction Layer (PAL) firmware. PAL firmware supports processor initialization, error recovery, and other functionality. It provides a consistent interface to system firmware and operating systems across processor hardware implementations. The Intel® Itanium® Architecture Software Developer’s Manual, Volume 2: System Architecture, describes PAL. Platforms must provide access to the firmware address space and PAL at reset to allow Itanium 2 processors to initialize.

The System Abstraction Layer (SAL) firmware contains platform-specific firmware to initialize the platform, boot to an operating system, and provide runtime functionality. Further information about SAL is available in the Intel® Itanium® Processor Family System Abstraction Layer Specification.

Datasheet

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Contents Intel Itanium 2 Processor DatasheetDatasheet Contents Processor Information ROM and Scratch Eeprom Supported Figures BINIT#, HIT#, HITM#, BNR#, TND#, BERR# Tables106 Revision No Description Date Revision HistoryIntel Itanium 2 Processor Product FeaturesDatasheet Processor Abstraction Layer OverviewState of Data Mixing Processors of Different Frequencies and Cache SizesTerminology Title Document Number Reference DocumentsIntroduction Itanium 2 Processor System Bus System Bus SignalsSystem Bus Power Pins Signal GroupsGroup Name Signals Signal DescriptionsItanium 2 Processor System Bus Signal Groups Symbol Parameter Core Minimum Typ Maximum Unit Package SpecificationsItanium 2 Processor Package Specifications Symbol Parameter Minimum Typ Maximum Unit Signal SpecificationsItanium 2 Processor Power Supply Specifications AGTL+ Signals DC Specifications Sheet 1TAP Connection DC Specifications AGTL+ Signals DC Specifications Sheet 2Power Good Signal DC Specifications System Bus Clock Differential Hstl DC SpecificationsMinimum Typ Maximum Unit SMBus DC SpecificationsLvttl Signal DC Specifications System Symbol ParameterMinimum Typ Maximum 11. SMBus AC Specifications12. Itanium 2 Processor Absolute Maximum Ratings Sheet 1 Maximum Ratings12. Itanium 2 Processor Absolute Maximum Ratings Sheet 2 Overshoot/Undershoot MagnitudeActivity Factor Overshoot/Undershoot Pulse DurationVcterm Reading Overshoot/Undershoot Specification TablesAF = 1 Shoot Parameter Description Specification UnitsAbsolute Pulse Duration ns Over0143 Wired-OR Signals 0513 Absolute Power Pod Connector Signals22. Itanium 2 Processor Power Pod Connector Signals Group Name Signals Power Pod ConnectorVID2 VID1 VID0 23. Processor Core Voltage Identification Code1State Transition Ramp Rate Comment 24. Processor Power StatesItanium 2 Processor System Bus Clock and Processor Clocking Ratio of Bus Frequency A21# A20# A19# A18# A17# 25. Itanium 2 Processor System Bus RatiosSystem Bus Reset and Configuration Timings for Cold Reset TAP Signals Recommended Connections for Unused Pins26. Connection for Unused Pins Sheet 1 Pins/Pin Groups RecommendedReserved Pins 26. Connection for Unused Pins Sheet 2System Management Signals Lvttl Power Pod SignalsPinout Specifications Pin Name System Bus Input/Output Signal Name Pin/Signal Information Sorted by Pin Name Sheet 1Pin Name System Bus Input/Output Pin/Signal Information Sorted by Pin Name Sheet 2Pin/Signal Information Sorted by Pin Name Sheet 3 Pin/Signal Information Sorted by Pin Name Sheet 4 Pin/Signal Information Sorted by Pin Name Sheet 5 Pin/Signal Information Sorted by Pin Name Sheet 6 Pin/Signal Information Sorted by Pin Name Sheet 7 Pin/Signal Information Sorted by Pin Name Sheet 8 Pin/Signal Information Sorted by Pin Name Sheet 9 Pin/Signal Information Sorted by Pin Name Sheet 10 Pin/Signal Information Sorted by Pin Name Sheet 11 Pin/Signal Information Sorted by Pin Name Sheet 12 Pin/Signal Information Sorted by Pin Name Sheet 13 Pin/Signal Information Sorted by Pin Name Sheet 14 Pin/Signal Information Sorted by Pin Name Sheet 15 Location Pin/Signal Information Sorted by Pin Location Sheet 1Pin/Signal Information Sorted by Pin Location Sheet 2 Pin/Signal Information Sorted by Pin Location Sheet 3 Pin/Signal Information Sorted by Pin Location Sheet 4 Pin/Signal Information Sorted by Pin Location Sheet 5 Pin/Signal Information Sorted by Pin Location Sheet 6 Pin/Signal Information Sorted by Pin Location Sheet 7 Pin/Signal Information Sorted by Pin Location Sheet 8 Pin/Signal Information Sorted by Pin Location Sheet 9 Pin/Signal Information Sorted by Pin Location Sheet 10 Pin/Signal Information Sorted by Pin Location Sheet 11 Pin/Signal Information Sorted by Pin Location Sheet 12 Pin/Signal Information Sorted by Pin Location Sheet 13 Pin/Signal Information Sorted by Pin Location Sheet 14 Pin/Signal Information Sorted by Pin Location Sheet 15 Pinout Specifications Itanium 2 Processor Package Mechanical DimensionsSubstrate Units ProcessorItanium 2 Processor Package Power Tab Processor Bottom-Side Marking Package MarkingProcessor Top-Side Marking Processor Bottom-Side Marking Placement on Interposer Mechanical Specifications Thermal Alert Thermal FeaturesEnhanced Thermal Management Case TemperatureCase Temperature Specification Symbol Parameter Core Minimum Maximum UnitItanium 2 Processor Package Thermocouple Location Thermal Specifications System Management Bus System Management Interface SignalsSystem Management Interface Signal Descriptions Signal Name Pin Count DescriptionSystem Management Feature Specifications 9Xh SMBus Device AddressingProcessor Information ROM Format Sheet 1 Processor Information ROMEeprom SMBus Addressing on the Itanium 2 Processor Cache Processor Information ROM Format Sheet 2Offset Function Examples Section Bits Part Numbers FeaturesProcessor Information ROM Format Sheet 3 Offset Function Examples Section Bits PackageOther Scratch EepromProcessor Information ROM Format Sheet 4 Byte Write SMBus Packet Thermal Sensing DeviceCurrent Address Read SMBus Packet Random Address Read SMBus PacketThermal Sensing Device Supported SMBus Transactions Thermal Reference Registers 13. Command Byte Bit AssignmentRegister Command Reset State Function Thermal Sensing Device RegistersStatus Register Configuration Register15. Thermal Sensing Device Configuration Register Thermal Limit Registers16. Thermal Sensing Device Conversion Rate Register Register Contents Conversion Rate HzConversion Rate Register Alphabetical Signals Reference 8 BE70# I/O Table A-2. Effective Memory Type Signal EncodingATTR30# I/O BCLKp/BCLKnBERR# I/O Table A-3. Special Transaction Encoding on Byte EnablesSpecial Transaction Byte Enables70# BPRI# BINIT# I/O11 BNR# I/O 12 BPM50# I/OPin Sampled Table A-6. BR30# Signals and Agent IDsBus Signal Agent 0 Pins Agent 3 Pins BREQ30# I/ODBSYC1# O CCL# I/OD1270# I/O # I/O25 DEP150# I/O DBSYC2# ODEFER# 24 DEN# I/ODRDYC2# O 27 DPS# I/ODRDY# I/O DRDYC1# OID90# 33 FCL# I/OFERR# O HIT# I/O and HITM# I/OLEN20# IP10#LEN20# I/O Table A-9. Length of Data TransfersREQ50# I/O LINT10OWN# I/O PMI#Transaction REQa50# REQb50# RESET#52 RP# I/O SBSYC2# O RS20#RSP# SBSYC1# OTable A-11. STBp70# and STBn70# Associations STBn70# and STBp70# I/OTDO O THRMTRIP# OTND# I/O Signal SummariesTable A-12. Output Signals Sheet 1 Name Active Level Clock Signal GroupName Active Level Clock Signal Group Qualified Table A-12. Output Signals Sheet 2Table A-13. Input Signals Table A-15. Input/Output Signals Multiple Driver Table A-14. Input/Output Signals Single Driver108