Intel Itanium 2 Processor manual Overshoot/Undershoot Magnitude

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Electrical Specifications

Table 2-12. Itanium® 2 Processor Absolute Maximum Ratings (Sheet 2 of 2)

Symbol

Parameter

Minimum

Maximum

Unit

Notes

 

 

 

 

 

 

 

Vin, SMBus

SMBus Buffer DC Input Voltage with

–0.1

6.0

V

4

 

 

 

 

Respect to GND

 

 

 

 

 

 

 

 

 

 

 

 

Vin, AGTL+

AGTL+ Buffer DC Input Voltage with

–0.1

1.9

V

5,

6

 

 

 

Respect to GND

 

 

 

 

 

 

 

 

 

 

 

 

VCTERM

Any VCTERM Voltage with Respect to

–0.1

1.9

V

3

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

Vin,TAP

TAP Buffer DC Input Voltage with

–0.1

2.1

V

5

 

 

 

 

Respect to GND.

 

 

 

 

 

 

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

1.Storage temperature is temperature in which the processor can be stored for up to one year.

2.Shipping temperature is temperature in which the processor can be shipped for up to 24 hours.

3.See Table 2-4through Table 2-9inclusive for operating voltages.

4.Parameters are from third party vendor specifications.

5.Maximum instantaneous voltage at receiver buffer input.

6.Specification includes Vin,AGTL+ and Vin,AGTL+ ASYNCHRONOUS (AGTL+ asynchronous buffer DC input voltage with respect to GND.

2.5System Bus Signal Quality Specifications and Measurement Guidelines

Overshoot (or undershoot) is the absolute value of the maximum voltage above the nominal

VCTERM voltage (or below GND), as shown in Table 2-3. The overshoot/undershoot specifications limit transitions beyond VCTERM or GND due to the fast signal edge rates. The processor can be permanently damaged by repeated overshoot or undershoot events on any input, output, or I/O buffer if the charge is large enough (that is, if the overshoot/undershoot is great enough). Determining the impact of an overshoot/undershoot condition requires knowledge of the magnitude, the pulse duration, and the activity factor (AF).

2.5.1Overshoot/Undershoot Magnitude

Magnitude describes the maximum potential difference between a signal and its voltage reference level. For the Itanium 2 processor, both are referenced to GND as shown in Figure 2-3. It is important to note that overshoot and undershoot conditions are separate and their impact must be determined independently. Overshoot/undershoot magnitude levels must observe the absolute maximum specifications listed in Table 2-13through Table 2-21. These specifications must not be violated at any time regardless of bus activity or system state. Within these specifications are threshold levels that define different allowed pulse duration. Provided that the magnitude of the overshoot/undershoot is within the absolute maximum specifications (1.8 V for overshoot and –0.60 V for undershoot), the pulse magnitude, duration and activity factor must all be used to determine if the overshoot/undershoot pulse is within specifications.

Datasheet

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Contents Intel Itanium 2 Processor DatasheetDatasheet Contents Processor Information ROM and Scratch Eeprom Supported Figures BINIT#, HIT#, HITM#, BNR#, TND#, BERR# Tables106 Revision No Description Date Revision HistoryIntel Itanium 2 Processor Product FeaturesDatasheet Processor Abstraction Layer OverviewState of Data Mixing Processors of Different Frequencies and Cache SizesTerminology Title Document Number Reference DocumentsIntroduction Itanium 2 Processor System Bus System Bus SignalsSystem Bus Power Pins Signal GroupsGroup Name Signals Signal DescriptionsItanium 2 Processor System Bus Signal Groups Symbol Parameter Core Minimum Typ Maximum Unit Package SpecificationsItanium 2 Processor Package Specifications Symbol Parameter Minimum Typ Maximum Unit Signal SpecificationsItanium 2 Processor Power Supply Specifications AGTL+ Signals DC Specifications Sheet 1TAP Connection DC Specifications AGTL+ Signals DC Specifications Sheet 2Power Good Signal DC Specifications System Bus Clock Differential Hstl DC SpecificationsMinimum Typ Maximum Unit SMBus DC SpecificationsLvttl Signal DC Specifications System Symbol ParameterMinimum Typ Maximum 11. SMBus AC Specifications12. Itanium 2 Processor Absolute Maximum Ratings Sheet 1 Maximum Ratings12. Itanium 2 Processor Absolute Maximum Ratings Sheet 2 Overshoot/Undershoot MagnitudeActivity Factor Overshoot/Undershoot Pulse DurationVcterm Reading Overshoot/Undershoot Specification TablesAF = 1 Shoot Parameter Description Specification UnitsAbsolute Pulse Duration ns Over0143 Wired-OR Signals 0513 Absolute Power Pod Connector Signals22. Itanium 2 Processor Power Pod Connector Signals Group Name Signals Power Pod ConnectorVID2 VID1 VID0 23. Processor Core Voltage Identification Code1State Transition Ramp Rate Comment 24. Processor Power StatesItanium 2 Processor System Bus Clock and Processor Clocking Ratio of Bus Frequency A21# A20# A19# A18# A17# 25. Itanium 2 Processor System Bus RatiosSystem Bus Reset and Configuration Timings for Cold Reset TAP Signals Recommended Connections for Unused Pins26. Connection for Unused Pins Sheet 1 Pins/Pin Groups RecommendedReserved Pins 26. Connection for Unused Pins Sheet 2System Management Signals Lvttl Power Pod SignalsPinout Specifications Pin Name System Bus Input/Output Signal Name Pin/Signal Information Sorted by Pin Name Sheet 1Pin Name System Bus Input/Output Pin/Signal Information Sorted by Pin Name Sheet 2Pin/Signal Information Sorted by Pin Name Sheet 3 Pin/Signal Information Sorted by Pin Name Sheet 4 Pin/Signal Information Sorted by Pin Name Sheet 5 Pin/Signal Information Sorted by Pin Name Sheet 6 Pin/Signal Information Sorted by Pin Name Sheet 7 Pin/Signal Information Sorted by Pin Name Sheet 8 Pin/Signal Information Sorted by Pin Name Sheet 9 Pin/Signal Information Sorted by Pin Name Sheet 10 Pin/Signal Information Sorted by Pin Name Sheet 11 Pin/Signal Information Sorted by Pin Name Sheet 12 Pin/Signal Information Sorted by Pin Name Sheet 13 Pin/Signal Information Sorted by Pin Name Sheet 14 Pin/Signal Information Sorted by Pin Name Sheet 15 Location Pin/Signal Information Sorted by Pin Location Sheet 1Pin/Signal Information Sorted by Pin Location Sheet 2 Pin/Signal Information Sorted by Pin Location Sheet 3 Pin/Signal Information Sorted by Pin Location Sheet 4 Pin/Signal Information Sorted by Pin Location Sheet 5 Pin/Signal Information Sorted by Pin Location Sheet 6 Pin/Signal Information Sorted by Pin Location Sheet 7 Pin/Signal Information Sorted by Pin Location Sheet 8 Pin/Signal Information Sorted by Pin Location Sheet 9 Pin/Signal Information Sorted by Pin Location Sheet 10 Pin/Signal Information Sorted by Pin Location Sheet 11 Pin/Signal Information Sorted by Pin Location Sheet 12 Pin/Signal Information Sorted by Pin Location Sheet 13 Pin/Signal Information Sorted by Pin Location Sheet 14 Pin/Signal Information Sorted by Pin Location Sheet 15 Pinout Specifications Itanium 2 Processor Package Mechanical DimensionsSubstrate Units ProcessorItanium 2 Processor Package Power Tab Processor Bottom-Side Marking Package MarkingProcessor Top-Side Marking Processor Bottom-Side Marking Placement on Interposer Mechanical Specifications Thermal Alert Thermal FeaturesEnhanced Thermal Management Case TemperatureCase Temperature Specification Symbol Parameter Core Minimum Maximum UnitItanium 2 Processor Package Thermocouple Location Thermal Specifications System Management Bus System Management Interface SignalsSystem Management Interface Signal Descriptions Signal Name Pin Count DescriptionSystem Management Feature Specifications 9Xh SMBus Device AddressingProcessor Information ROM Format Sheet 1 Processor Information ROMEeprom SMBus Addressing on the Itanium 2 Processor Cache Processor Information ROM Format Sheet 2Offset Function Examples Section Bits Part Numbers FeaturesProcessor Information ROM Format Sheet 3 Offset Function Examples Section Bits PackageOther Scratch EepromProcessor Information ROM Format Sheet 4 Byte Write SMBus Packet Thermal Sensing DeviceCurrent Address Read SMBus Packet Random Address Read SMBus PacketThermal Sensing Device Supported SMBus Transactions Thermal Reference Registers 13. Command Byte Bit AssignmentRegister Command Reset State Function Thermal Sensing Device RegistersStatus Register Configuration Register15. Thermal Sensing Device Configuration Register Thermal Limit Registers16. Thermal Sensing Device Conversion Rate Register Register Contents Conversion Rate HzConversion Rate Register Alphabetical Signals Reference 8 BE70# I/O Table A-2. Effective Memory Type Signal EncodingATTR30# I/O BCLKp/BCLKnBERR# I/O Table A-3. Special Transaction Encoding on Byte EnablesSpecial Transaction Byte Enables70# BPRI# BINIT# I/O11 BNR# I/O 12 BPM50# I/OPin Sampled Table A-6. BR30# Signals and Agent IDsBus Signal Agent 0 Pins Agent 3 Pins BREQ30# I/ODBSYC1# O CCL# I/OD1270# I/O # I/O25 DEP150# I/O DBSYC2# ODEFER# 24 DEN# I/ODRDYC2# O 27 DPS# I/ODRDY# I/O DRDYC1# OID90# 33 FCL# I/OFERR# O HIT# I/O and HITM# I/OLEN20# IP10#LEN20# I/O Table A-9. Length of Data TransfersREQ50# I/O LINT10OWN# I/O PMI#Transaction REQa50# REQb50# RESET#52 RP# I/O SBSYC2# O RS20#RSP# SBSYC1# OTable A-11. STBp70# and STBn70# Associations STBn70# and STBp70# I/OTDO O THRMTRIP# OTND# I/O Signal SummariesTable A-12. Output Signals Sheet 1 Name Active Level Clock Signal GroupName Active Level Clock Signal Group Qualified Table A-12. Output Signals Sheet 2Table A-13. Input Signals Table A-15. Input/Output Signals Multiple Driver Table A-14. Input/Output Signals Single Driver108