Intel manual Mechanical Dimensions, Itanium 2 Processor Package

4Mechanical Specifications

This chapter provides the mechanical specifications of the Itanium 2 processor.

4.1Mechanical Dimensions

The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and an integrated heat spreader (IHS), as illustrated in Figure 4-1. The interposer interfaces with the socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS, which is mounted on the top surface of the processor package substrate, efficiently transfers the heat generated by the die to its surface.

Figure 4-1. Itanium® 2 Processor Package

IHS

Processor

Package

Substrate

(OLGA)

Interposer

001160e

Figure 4-2contains mechanical drawings and dimensions for the Itanium 2 processor package. Figure 4-3contains mechanical drawing for the power tab. All dimensions are measured in mm and are not to scale.

Datasheet 69