Intel Itanium 2 Processor manual Package Marking, Processor Top-Side Marking

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Mechanical Specifications

4.2Package Marking

The following section details the processor top-side and bottom-side markings for the Itanium 2 processor and is provided as an identification aid. The processor top-side mark for the product is a laser marking on the IHS.

4.2.1Processor Top-Side Marking

Figure 4-4shows an example of the laser marking on the IHS. The processor top-side mark provides the following information:

INTEL CONFIDENTIAL

Legal Mark

Assembly Process Order (APO) number

Serial Number

Figure 4-4. Processor Top-Side Marking on IHS

INTEL CONFIDENTIAL

i M C 'YY

APO NUMBER

SERIAL NUMBER

001088b

4.2.2Processor Bottom-Side Marking

The processor bottom-side mark for the product is a laser marking on the pin side of the interposer. Figure 4-5shows the placement of the laser marking on the pin side of interposer. The processor bottom-side mark provides the following information:

Product ID

Finish Process Order (FPO)

Serial Number

S-Spec

Country of origin

2D Matrix Mark (on Itanium 2 processor [1.30 GHz, 1.40 GHz, 1.50 GHz, 1.60 GHz], Itanium 2 (9 MB) class of processors and Montecito class of processors only. Not included on the Itanium 2 [900 MHz, 1.0 GHz] processor).

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Datasheet

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Contents Datasheet Intel Itanium 2 ProcessorDatasheet Contents Processor Information ROM and Scratch Eeprom Supported Figures Tables BINIT#, HIT#, HITM#, BNR#, TND#, BERR#106 Revision History Revision No Description DateProduct Features Intel Itanium 2 ProcessorDatasheet Overview Processor Abstraction LayerMixing Processors of Different Frequencies and Cache Sizes TerminologyState of Data Reference Documents Title Document NumberIntroduction System Bus Signals System Bus Power PinsSignal Groups Itanium 2 Processor System BusSignal Descriptions Itanium 2 Processor System Bus Signal GroupsGroup Name Signals Package Specifications Itanium 2 Processor Package SpecificationsSymbol Parameter Core Minimum Typ Maximum Unit Signal Specifications Itanium 2 Processor Power Supply SpecificationsAGTL+ Signals DC Specifications Sheet 1 Symbol Parameter Minimum Typ Maximum UnitAGTL+ Signals DC Specifications Sheet 2 Power Good Signal DC SpecificationsSystem Bus Clock Differential Hstl DC Specifications TAP Connection DC SpecificationsSMBus DC Specifications Lvttl Signal DC SpecificationsSystem Symbol Parameter Minimum Typ Maximum Unit11. SMBus AC Specifications Minimum Typ MaximumMaximum Ratings 12. Itanium 2 Processor Absolute Maximum Ratings Sheet 1Overshoot/Undershoot Magnitude 12. Itanium 2 Processor Absolute Maximum Ratings Sheet 2Overshoot/Undershoot Pulse Duration Activity FactorReading Overshoot/Undershoot Specification Tables VctermParameter Description Specification Units Absolute Pulse Duration nsOver AF = 1 Shoot0143 Wired-OR Signals 0513 Power Pod Connector Signals 22. Itanium 2 Processor Power Pod Connector SignalsGroup Name Signals Power Pod Connector Absolute23. Processor Core Voltage Identification Code1 VID2 VID1 VID024. Processor Power States Itanium 2 Processor System Bus Clock and Processor ClockingState Transition Ramp Rate Comment 25. Itanium 2 Processor System Bus Ratios Ratio of Bus Frequency A21# A20# A19# A18# A17#System Bus Reset and Configuration Timings for Cold Reset Recommended Connections for Unused Pins 26. Connection for Unused Pins Sheet 1Pins/Pin Groups Recommended TAP Signals26. Connection for Unused Pins Sheet 2 System Management SignalsLvttl Power Pod Signals Reserved PinsPinout Specifications Pin/Signal Information Sorted by Pin Name Sheet 1 Pin Name System Bus Input/Output Signal NamePin/Signal Information Sorted by Pin Name Sheet 2 Pin Name System Bus Input/OutputPin/Signal Information Sorted by Pin Name Sheet 3 Pin/Signal Information Sorted by Pin Name Sheet 4 Pin/Signal Information Sorted by Pin Name Sheet 5 Pin/Signal Information Sorted by Pin Name Sheet 6 Pin/Signal Information Sorted by Pin Name Sheet 7 Pin/Signal Information Sorted by Pin Name Sheet 8 Pin/Signal Information Sorted by Pin Name Sheet 9 Pin/Signal Information Sorted by Pin Name Sheet 10 Pin/Signal Information Sorted by Pin Name Sheet 11 Pin/Signal Information Sorted by Pin Name Sheet 12 Pin/Signal Information Sorted by Pin Name Sheet 13 Pin/Signal Information Sorted by Pin Name Sheet 14 Pin/Signal Information Sorted by Pin Name Sheet 15 Pin/Signal Information Sorted by Pin Location Sheet 1 LocationPin/Signal Information Sorted by Pin Location Sheet 2 Pin/Signal Information Sorted by Pin Location Sheet 3 Pin/Signal Information Sorted by Pin Location Sheet 4 Pin/Signal Information Sorted by Pin Location Sheet 5 Pin/Signal Information Sorted by Pin Location Sheet 6 Pin/Signal Information Sorted by Pin Location Sheet 7 Pin/Signal Information Sorted by Pin Location Sheet 8 Pin/Signal Information Sorted by Pin Location Sheet 9 Pin/Signal Information Sorted by Pin Location Sheet 10 Pin/Signal Information Sorted by Pin Location Sheet 11 Pin/Signal Information Sorted by Pin Location Sheet 12 Pin/Signal Information Sorted by Pin Location Sheet 13 Pin/Signal Information Sorted by Pin Location Sheet 14 Pin/Signal Information Sorted by Pin Location Sheet 15 Pinout Specifications Mechanical Dimensions Itanium 2 Processor PackageProcessor Substrate UnitsItanium 2 Processor Package Power Tab Package Marking Processor Top-Side MarkingProcessor Bottom-Side Marking Processor Bottom-Side Marking Placement on Interposer Mechanical Specifications Thermal Features Thermal AlertCase Temperature Case Temperature SpecificationSymbol Parameter Core Minimum Maximum Unit Enhanced Thermal ManagementItanium 2 Processor Package Thermocouple Location Thermal Specifications System Management Interface Signals System Management Interface Signal DescriptionsSignal Name Pin Count Description System Management BusSystem Management Feature Specifications SMBus Device Addressing 9XhProcessor Information ROM Eeprom SMBus Addressing on the Itanium 2 ProcessorProcessor Information ROM Format Sheet 1 Processor Information ROM Format Sheet 2 Offset Function Examples Section BitsCache Features Processor Information ROM Format Sheet 3Offset Function Examples Section Bits Package Part NumbersScratch Eeprom Processor Information ROM Format Sheet 4Other Thermal Sensing Device Current Address Read SMBus PacketRandom Address Read SMBus Packet Byte Write SMBus PacketThermal Sensing Device Supported SMBus Transactions 13. Command Byte Bit Assignment Register Command Reset State FunctionThermal Sensing Device Registers Thermal Reference RegistersConfiguration Register 15. Thermal Sensing Device Configuration RegisterThermal Limit Registers Status RegisterRegister Contents Conversion Rate Hz Conversion Rate Register16. Thermal Sensing Device Conversion Rate Register Alphabetical Signals Reference Table A-2. Effective Memory Type Signal Encoding ATTR30# I/OBCLKp/BCLKn 8 BE70# I/OTable A-3. Special Transaction Encoding on Byte Enables Special Transaction Byte Enables70#BERR# I/O BINIT# I/O 11 BNR# I/O12 BPM50# I/O BPRI#Table A-6. BR30# Signals and Agent IDs Bus Signal Agent 0 Pins Agent 3 PinsBREQ30# I/O Pin SampledCCL# I/O D1270# I/O# I/O DBSYC1# ODBSYC2# O DEFER#24 DEN# I/O 25 DEP150# I/O27 DPS# I/O DRDY# I/ODRDYC1# O DRDYC2# O33 FCL# I/O FERR# OHIT# I/O and HITM# I/O ID90#IP10# LEN20# I/OTable A-9. Length of Data Transfers LEN20#LINT10 OWN# I/OPMI# REQ50# I/ORESET# 52 RP# I/OTransaction REQa50# REQb50# RS20# RSP#SBSYC1# O SBSYC2# OSTBn70# and STBp70# I/O TDO OTHRMTRIP# O Table A-11. STBp70# and STBn70# AssociationsSignal Summaries Table A-12. Output Signals Sheet 1Name Active Level Clock Signal Group TND# I/OTable A-12. Output Signals Sheet 2 Table A-13. Input SignalsName Active Level Clock Signal Group Qualified Table A-14. Input/Output Signals Single Driver Table A-15. Input/Output Signals Multiple Driver108