Intel 31244 PCI-X manual Thermal Solutions, Thermal Recommendations, Thermal Resistance

Intel® 31244 PCI-X to Serial ATA Controller

Thermal Solutions

Thermal Solutions 15

GD31244 is packaged in a 17 mm, 256-pin Plastic Ball Grid Array (PBGA) in an industry-standard footprint. The package includes a four layer substrate with power and ground planes. The construction of the package is shown below. The device is specified for operation when TC (case temperature) is within the range of 0o C to 90o C, depending on the operating conditions. Refer to Figure 3 for a details on the package.

Table 37.	Thermal Resistance
	Symbol	Description	Value	Units
	T	Still air ambient temperature to meet maximum case temperature	70	oC
	A	specifications: [TA = TC - (PDMAX-θca)]
	θ	Thermal resistance from case to ambient in still air including	20	oC/Watt
	ca	conduction through the leads

Table 38.	544-Lead H-PBGA Package Thermal Characteristics
		Thermal Resistance - oC/Watt
	Parameter			Airflow - ft/min. (M./sec.)
			0	100	200	400	600
	θca		20	12.5	11.2	10.2	9.2
	Thermal Resistance from case to Ambient

15.1Thermal Recommendations

Based on data Intel gathered while performing thermal validation, the GD31244 does not require a heat sink. The tests were performed in an environment with no airflow, an ambient temperature of 60° C with the processor executing a maximum power test. However, when the case temperature (108° C) is exceeded, a passive heat sink may be used.

Design Guide 77