CY7C63310, CY7C638xx
29. Ordering Information
Ordering Code | FLASH Size | RAM Size | Package Type |
3K | 128 | ||
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3K | 128 | ||
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4K | 256 | ||
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4K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | Die form | |
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8K | 256 | ||
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8K | 256 | ||
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8K | 256 | ||
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30. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may degrade device reliability.
Parameter | Description | Min | Typical | Max | Unit |
TBAKETEMP | Bake Temperature |
| 125 | See package label | °C |
TBAKETIME | Bake Time | See package label |
| 72 | hours |
Document | Page 75 of 83 |
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