HP Modular Cooling System manual Electrical specifications

Page 18

Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2159 mm (85 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

914.4 mm (36 inches)

600 mm (23.6 inches)

600 mm (23.6 inches)

 

 

 

 

Depth

1727 mm (68 inches)

1200 mm (47.2 inches)

1200 mm (47.2 inches)

Weight

265 kg (584 lb)1

135 kg (299 lb)2

1042 kg (2297 lb)3

MCS-200 (single rack configuration) physical specifications

 

 

 

 

 

Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2285 mm (90 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

1219 mm (48 inches)

904 mm (35.6 inches)

904 mm (35.6 inches)

 

 

 

 

Depth

1829 mm (72 inches)

1510 mm (59.5 inches)

1510 mm (59.5 inches)

Weight

732 kg (1614 lb)1

478 kg (1054 lb)2

1521 kg (3353 lb)3

MCS-200 expansion rack physical specifications

 

 

 

 

 

Parameter

Packaged system (as

Unpackaged system

Unpackaged CTO system

 

shipped on pallet)

(off pallet, unwrapped)

 

 

 

 

 

Height

2159 mm (85 inches)

2007 mm (79 inches)

2007 mm (79 inches)

Width

914.4 mm (36 inches)

600 mm (23.6 inches)

600 mm (23.6 inches)

 

 

 

 

Depth

1727 mm (68 inches)

1399 mm (55.1 inches)

1399 mm (55.1 inches)

Weight

308 kg (680 lb)1

179 kg (395 lb)2

1222 kg (2694 lb)3

1 Weight for a completely packaged system with unpopulated server rack 2 Weight for an unpackaged system with unpopulated server rack

3 Approximate weight for an unpackaged CTO system (actual weight varies, according to configuration)

If the top shipping bracket interferes with deploying the MCS-200/100, it can be removed. With the top shipping bracket, the total height of the unpackaged system is 2069 mm (81.5 inches).

Electrical specifications

The following table lists the electrical specifications for the MCS-100 unit.

Parameter

Value

Comments

 

 

 

 

Operating voltage

230

VAC +/- 10%, 50 Hz

 

208

VAC +/- 10%, 60 Hz

 

AC line phase

Single

Maximum input current

18 A

Per line cord

Maximum inrush current

200

A

Per line cord

Dropout/hold-up time at

20 ms

minimum line voltage

 

 

 

Transfer time of AC transfer

2 s

 

switch

 

 

 

Circuit breaker rating

LAHJ

 

Per cord

Power factor

> 0.95

At all loads

Ground leakage current

< 19.4 mA

Per line cord

Overview 18

Image 18
Contents HP Modular Cooling System 200/100 Site Preparation Guide Part Number June EditionPage Contents Appendix B Conversion factors and formulas Before you contact HP HP contact informationOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view Physical specifications MCS-100 expansion rack physical specificationsElectrical specifications Parameter Value Comments Facility planning for implementation Facility planning overviewSpace and positioning considerations Delivery space requirements Maneuvering space requirementsMCS-200/100 Reference Operational space requirements MCS-200/100 expansion rack ReferenceFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Cabinet leveling feet Top view Bottom viewFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Term Description WeightElectrical considerations RatingSystem grounding MCS-200 Raised floor grounding Description Connecting to facility A/C power Voltage fluctuations and outagesElectrical planning around water-handling components Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view Raised floor cutouts for the MCS unit Rear viewMCS-100 floor tile cutouts Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Description Specifications StrainerTypical plumbing installation guidelines Watts TP or equivalentCoolant requirements General thermal requirementsCooling loop sizing Determining heat load capacitiesPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Acceptable water quality specifications Additional water precautionsControl system Before installing and running active componentsEnvironmental considerations Plumbing materials to avoidFacility planning for implementation Appendix a Forms and checklists Dimension MeasurementDelivery survey form Pre-installation checklists Site preparation checklistArea/condition Yes Comment/date Safety considerations Appendix a Forms and checklists Appendix B Conversion factors and formulas Conversion factors and formulasSafety and regulatory compliance Warranty information Regulatory requirements for Exit signsRegulatory information Regulatory information Support and other resources Before you contact HPHP contact information Acronyms and abbreviations Uninterruptible power system Water steam pressureDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.