HP Modular Cooling System manual Index

Page 92

Index

A

acceptable water quality specifications

78

Appendix

81, 85

 

B

battery replacement notice

86

 

before installing/running active components

79

BSMI notice

86

 

 

C

cabinet leveling feet

29

cable openings

26

 

Canadian notice

86

 

chilled water

45, 67

 

Chilled Water Base Station, configuring

45

chilled water system components

67

 

chiller unit

67

 

 

 

 

common floor-loading terms

40

 

 

compliance

86

 

 

 

 

components

12, 67

 

 

 

 

components, identification

12

 

 

connecting to facility A/C power

43

 

contact information

88

 

 

 

contacting HP

88

 

 

 

 

control system

79

 

 

 

 

conversion factors for refrigeration

85

 

coolant requirements

71

 

 

 

coolant source planning

45

 

 

cooling 45, 67, 71, 72

 

 

 

cooling capacity 72

 

 

 

cooling considerations

83

 

 

cooling loop sizing

72

 

 

 

customer self repair (CSR)

88

 

 

D

Declaration of Conformity

86

delivery space requirements

21

delivery survey

81

 

disposal, battery

86

 

disposal, waste

86

 

documentation feedback

91

E

electrical

43

 

 

 

electrical considerations

40

 

electrical factors

40

 

 

electrical planning

43

 

 

electrical safety

43

 

 

electrical specifications

18

 

environmental considerations

78, 79

environmental specifications

79

European Union notice

86

 

EXIT signs

86

 

 

 

F

facility considerations

82

facility planning

20, 55, 82

Federal Communications Commission (FCC)

notice

86

 

floor cutouts

 

55

 

floor loading

37, 40

 

floor plan grid

55

 

formulas

85

 

 

G

grounding 41

 

grounding methods

41

grounding systems

41

H

heat load capacity 72

Hook Up Kit

47

hose openings

52

hoses

52

 

I

installation preparation

20, 46, 70, 79

installation prerequisites

20, 21, 23, 25, 37, 70

J

Japanese notice

86

Index 92

Image 92
Contents HP Modular Cooling System 200/100 Site Preparation Guide Part Number June EditionPage Contents Appendix B Conversion factors and formulas Before you contact HP HP contact informationOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view Physical specifications MCS-100 expansion rack physical specificationsElectrical specifications Parameter Value Comments Space and positioning considerations Facility planning for implementationFacility planning overview Delivery space requirements Maneuvering space requirementsMCS-200/100 Reference Operational space requirements MCS-200/100 expansion rack ReferenceFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Cabinet leveling feet Top view Bottom viewFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Weight Electrical considerationsTerm Description RatingSystem grounding MCS-200 Raised floor grounding Description Electrical planning around water-handling components Connecting to facility A/C powerVoltage fluctuations and outages Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view MCS-100 floor tile cutouts Raised floor cutouts for the MCS unitRear view Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Description Specifications StrainerTypical plumbing installation guidelines Watts TP or equivalentCoolant requirements General thermal requirementsCooling loop sizing Determining heat load capacitiesPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Acceptable water quality specifications Additional water precautionsBefore installing and running active components Environmental considerationsControl system Plumbing materials to avoidFacility planning for implementation Delivery survey form Appendix a Forms and checklistsDimension Measurement Area/condition Yes Comment/date Pre-installation checklistsSite preparation checklist Safety considerations Appendix a Forms and checklists Appendix B Conversion factors and formulas Conversion factors and formulasRegulatory information Safety and regulatory complianceWarranty information Regulatory requirements for Exit signs Regulatory information HP contact information Support and other resourcesBefore you contact HP Acronyms and abbreviations Uninterruptible power system Water steam pressureDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.