HP Modular Cooling System manual Regulatory information, Safety and regulatory compliance

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Regulatory information

Safety and regulatory compliance

For safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the HP website (http://www.hp.com/support/Safety-Compliance-EnterpriseProducts).

Turkey RoHS material content declaration Ukraine RoHS material content declaration

Warranty information

HP ProLiant and X86 Servers and Options (http://www.hp.com/support/ProLiantServers-Warranties)

HP Enterprise Servers (http://www.hp.com/support/EnterpriseServers-Warranties)

HP Storage Products (http://www.hp.com/support/Storage-Warranties)

HP Networking Products (http://www.hp.com/support/Networking-Warranties)

Regulatory requirements for EXIT signs

Manufacturers of tritium EXIT signs are “specific licensees,” meaning they are licensed by the NRC or an Agreement State. The signs are considered “generally licensed devices,” because they are inherently safe enough to be handled or used by anyone with no radiation training or experience. Although purchasers – known as “general licensees” – do not need authorization from the NRC or a state regulatory agency to possess the signs, they are subject to certain regulatory requirements regarding handling, transfer or disposal of the signs. For more information, see the NRC website (http://www.nrc.gov/reading-rm/doc-collections/fact-sheets/fs-tritium.html#_edn2). They are also subject to NRC or Agreement State inspection and enforcement action (including fines) for violating those requirements. Manufacturers must inform purchasers of the EXIT signs of the regulatory requirements for generally licensed devices. The general licensee is required to designate an individual responsible for complying with the regulatory requirements.

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Contents HP Modular Cooling System 200/100 Site Preparation Guide Part Number June EditionPage Contents Appendix B Conversion factors and formulas Before you contact HP HP contact informationOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view Physical specifications MCS-100 expansion rack physical specificationsElectrical specifications Parameter Value Comments Space and positioning considerations Facility planning for implementationFacility planning overview Delivery space requirements Maneuvering space requirementsMCS-200/100 Reference Operational space requirements MCS-200/100 expansion rack ReferenceFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Cabinet leveling feet Top view Bottom viewFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Term Description WeightElectrical considerations RatingSystem grounding MCS-200 Raised floor grounding Description Electrical planning around water-handling components Connecting to facility A/C powerVoltage fluctuations and outages Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view MCS-100 floor tile cutouts Raised floor cutouts for the MCS unitRear view Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Description Specifications StrainerTypical plumbing installation guidelines Watts TP or equivalentCoolant requirements General thermal requirementsCooling loop sizing Determining heat load capacitiesPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Acceptable water quality specifications Additional water precautionsControl system Before installing and running active componentsEnvironmental considerations Plumbing materials to avoidFacility planning for implementation Delivery survey form Appendix a Forms and checklistsDimension Measurement Area/condition Yes Comment/date Pre-installation checklistsSite preparation checklist Safety considerations Appendix a Forms and checklists Appendix B Conversion factors and formulas Conversion factors and formulasRegulatory information Safety and regulatory complianceWarranty information Regulatory requirements for Exit signs Regulatory information HP contact information Support and other resourcesBefore you contact HP Acronyms and abbreviations Uninterruptible power system Water steam pressureDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.