HP Modular Cooling System manual Coolant source planning

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When using only a single, primary source for power, the AC power cord is connected to the left-most receptacle.

When redundant AC power is available, the redundant AC power cord is connected to the right receptacle.

Coolant source planning

CAUTION: The minerals and chemicals typically found in tap water can react with metallic elements used in the HP Modular Cooling System 200/100 closed-loop distribution system. Electrochemical reactions can cause scaling, corrosion, leaks, and blockage, ultimately resulting in reduced efficiency of the cooling system and even damage.

A number of factors relating to a facility water distribution system must be considered during the site preparation process, including the following:

•Redundant water configurations. For more information, see Appendix B: Conversion factors and formulas (on page 85).

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Contents Part Number June Edition HP Modular Cooling System 200/100 Site Preparation GuidePage Contents Before you contact HP HP contact information Appendix B Conversion factors and formulasOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view MCS-100 expansion rack physical specifications Physical specificationsElectrical specifications Parameter Value Comments Facility planning for implementation Facility planning overviewSpace and positioning considerations Maneuvering space requirements Delivery space requirementsMCS-200/100 Reference MCS-200/100 expansion rack Reference Operational space requirementsFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Top view Bottom view Cabinet leveling feetFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Electrical considerations WeightTerm Description RatingSystem grounding MCS-200 Raised floor grounding Description Connecting to facility A/C power Voltage fluctuations and outagesElectrical planning around water-handling components Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view Raised floor cutouts for the MCS unit Rear viewMCS-100 floor tile cutouts Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Strainer Description SpecificationsWatts TP or equivalent Typical plumbing installation guidelinesGeneral thermal requirements Coolant requirementsDetermining heat load capacities Cooling loop sizingPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Additional water precautions Acceptable water quality specificationsEnvironmental considerations Before installing and running active componentsControl system Plumbing materials to avoidFacility planning for implementation Appendix a Forms and checklists Dimension MeasurementDelivery survey form Pre-installation checklists Site preparation checklistArea/condition Yes Comment/date Safety considerations Appendix a Forms and checklists Conversion factors and formulas Appendix B Conversion factors and formulasSafety and regulatory compliance Warranty information Regulatory requirements for Exit signsRegulatory information Regulatory information Support and other resources Before you contact HPHP contact information Acronyms and abbreviations Water steam pressure Uninterruptible power systemDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.
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