HP Modular Cooling System manual Cooling loop sizing, Determining heat load capacities

Page 72

Cooling loop sizing

Sizing the cooling loops can be straight forward based on the planned cooling requirements of each populated/planned MCS-200/100 server enclosure. The amount of heat, in watts, that needs to be removed from each component in the server rack must be added together to obtain the total heat to be removed by the MCS-200/100 cabinet. You can copy the following table for documenting individual cabinet calculations. Calculations must include the equipment installed today and additional equipment planned for installation over the design life of the system.

Rack Cooling Loop Sizing Chart

Installed

Quantity

Max. Watts

Max. CFM

Max. Watts

Max. CFM Total

Component

 

Generated

Required

Total

 

 

 

 

 

 

 

Component 1:

 

 

 

 

 

 

 

 

 

 

 

Component 2:

 

 

 

 

 

 

 

 

 

 

 

Component 3:

 

 

 

 

 

 

 

 

 

 

 

Component 4:

 

 

 

 

 

 

 

 

 

 

 

Component 5:

 

 

 

 

 

 

 

 

 

 

 

Component 6:

 

 

 

 

 

 

 

 

 

 

 

Component 7:

 

 

 

 

 

 

 

 

 

 

 

Component 8:

 

 

 

 

 

 

 

 

 

 

 

Component 9:

 

 

 

 

 

 

 

 

 

 

 

Component 10:

 

 

 

 

 

 

 

 

 

 

 

Total for Cabinet*

 

 

 

 

 

 

 

 

 

 

 

*An approximate value can be estimated by assuming all power entering the cabinet is converted to heat.

After calculating the total expected required heat load, use the charts in “Determining heat load capacities (on page 72)” to determine required water flow and pressure based on potential chilled water temperatures. The PSID must be measured prior to the cold water inlet/after warm water outlet. All water system equipment, materials, and installation must comply with any applicable construction codes and LAHJ.

Determining heat load capacities

The total airflow required by the equipment installed in each server rack must be compared with the total available supply from the MCS-200/100, so it is not exceeded. The fans in the MCS-200/100 are speed-controlled to reduce the airflow in case the maximum cooling capacity is not demanded from the MCS-200/100.

MCS per rack capacity chart

Number of fans

HP Modular

HP Modular

MCS-200/100

MCS-200/100 with

 

Cooling System

Cooling System

 

Expansion Rack

 

200/100

200/100 with

 

 

 

 

Expansion Rack

 

 

 

 

 

 

 

1 fan (BW978A)

10kW, 934 CFM

5kW, 467 CFM

N/A

N/A

2 fans

20kW, 1,866 CFM

10kW, 933 CFM

N/A

N/A

3 fans

30kW, 2,800 CFM

15kW, 1,400 CFM

N/A

N/A

Facility planning for implementation 72

Image 72
Contents HP Modular Cooling System 200/100 Site Preparation Guide Part Number June EditionPage Contents Appendix B Conversion factors and formulas Before you contact HP HP contact informationOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view Physical specifications MCS-100 expansion rack physical specificationsElectrical specifications Parameter Value Comments Facility planning for implementation Facility planning overviewSpace and positioning considerations Delivery space requirements Maneuvering space requirementsMCS-200/100 Reference Operational space requirements MCS-200/100 expansion rack ReferenceFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Cabinet leveling feet Top view Bottom viewFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Weight Electrical considerationsTerm Description RatingSystem grounding MCS-200 Raised floor grounding Description Connecting to facility A/C power Voltage fluctuations and outagesElectrical planning around water-handling components Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view Raised floor cutouts for the MCS unit Rear viewMCS-100 floor tile cutouts Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Description Specifications StrainerTypical plumbing installation guidelines Watts TP or equivalentCoolant requirements General thermal requirementsCooling loop sizing Determining heat load capacitiesPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Acceptable water quality specifications Additional water precautionsBefore installing and running active components Environmental considerationsControl system Plumbing materials to avoidFacility planning for implementation Appendix a Forms and checklists Dimension MeasurementDelivery survey form Pre-installation checklists Site preparation checklistArea/condition Yes Comment/date Safety considerations Appendix a Forms and checklists Appendix B Conversion factors and formulas Conversion factors and formulasSafety and regulatory compliance Warranty information Regulatory requirements for Exit signsRegulatory information Regulatory information Support and other resources Before you contact HPHP contact information Acronyms and abbreviations Uninterruptible power system Water steam pressureDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.