HP Modular Cooling System manual Electrical considerations, Weight, Term Description, Rating

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Item

A

B

C

D

E

F

G

H

Weight

385 kg (849 lb)

455 kg (1003 lb)

458 kg (1010 lb)

385 kg (849 lb)

375 kg (827 lb)

457 kg (1007 lb)

457 kg (1007 lb)

375 kg (827 lb)

CAUTION: To reduce the risk of damage to the casters, make sure that the full weight of the rack rests on the leveling feet and feet pads, and not on the casters. The casters are designed only as an aid in moving the rack into position. They are not designed to support the weight of the rack, and the casters may become damaged if relied on to support the rack.

Common floor-loading terms

Term

Description

 

 

Dead load

The weight rating for the load the floor can support expressed in kg/m² (lb/ft²)

 

 

Uniform load

The load that the floor system can safely support; expressed in kg/m² (lb/ft² or kN/m²)

Concentrated load*

The load that a floor panel can support on a 25 x 25 mm² (1 x 1 inches²) at the panels

 

weakest point (typically the center of the panel), without the surface of the panel

 

deflecting more than a predetermined amount

 

 

Rolling load

The load a floor panel can support (without failure) when a wheel of specified diameter

 

and width is rolled across the panel

Example: Tate All Steel 1250 raised floor specifications

Item

Rating

 

 

Dead load

34.2 kg/m² (7 lb/ft²)

 

 

Uniform load

1,552 kg/m² (400 lb/ft²)

Concentrated load*

567 kg (1,250 lb)

Rolling load

227 kg (500 lb)

*With 2.54 mm (0.10 inch) of span maximum deflection

Electrical considerations

The electrical practices and suggestions in this guide are based on North American practices. For regions and areas outside North America, local electrical codes take precedence. An example would be the recommendation that the protective ground conductor should be green with yellow stripes—this requirement is a North American directive and does not override the local code requirements for a region or areas outside North America.

WARNING: To avoid personal injury and damage to the equipment, be sure that an emergency power shut off switch is in place and is easily accessible.

Facility planning for implementation 40

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Contents HP Modular Cooling System 200/100 Site Preparation Guide Part Number June EditionPage Contents Appendix B Conversion factors and formulas Before you contact HP HP contact informationOverview OverviewMCS-100 unit dual-rack configuration MCS-200 unit single-rack configuration Product overview Air flow for MCS-100 single-rack configuration Air flow for MCS-100 dual-rack configuration Air flow for MCS-200 single-rack configuration Key components MCS-100 components Description MCS-200 components Unit top view Physical specifications MCS-100 expansion rack physical specificationsElectrical specifications Parameter Value Comments Facility planning overview Facility planning for implementationSpace and positioning considerations Delivery space requirements Maneuvering space requirementsMCS-200/100 Reference Operational space requirements MCS-200/100 expansion rack ReferenceFacility planning for implementation System positioning Cable openings Facility planning for implementation Facility planning for implementation Cabinet leveling feet Top view Bottom viewFacility planning for implementation MCS-100 dual-rack configuration IT rack side view MCS-100 single-rack configuration Facility planning for implementation MCS-200 single-rack configuration MCS-200 dual-rack configuration IT rack side view MCS-200 single-rack configuration Floor loading considerations Facility planning for implementation Page Weight Electrical considerationsTerm Description RatingSystem grounding MCS-200 Raised floor grounding Description Voltage fluctuations and outages Connecting to facility A/C powerElectrical planning around water-handling components Facility planning for implementation Coolant source planning Plumbing considerations HP Water Hook-Up Kit M6 screw Above the floor for MCS-200 only Facility planning for implementation Piping approaches Hose openings Bottom view Top view MCS-200 hose openings Bottom view Top view Rear view Raised floor cutouts for the MCS unitMCS-100 floor tile cutouts Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Chilled water system components Fittings Astm B16.22 Wrought copper Description Specifications StrainerTypical plumbing installation guidelines Watts TP or equivalentCoolant requirements General thermal requirementsCooling loop sizing Determining heat load capacitiesPage Facility planning for implementation Facility planning for implementation Facility planning for implementation Facility planning for implementation Acceptable water quality specifications Additional water precautionsBefore installing and running active components Environmental considerationsControl system Plumbing materials to avoidFacility planning for implementation Dimension Measurement Appendix a Forms and checklistsDelivery survey form Site preparation checklist Pre-installation checklistsArea/condition Yes Comment/date Safety considerations Appendix a Forms and checklists Appendix B Conversion factors and formulas Conversion factors and formulasWarranty information Regulatory requirements for Exit signs Safety and regulatory complianceRegulatory information Regulatory information Before you contact HP Support and other resourcesHP contact information Acronyms and abbreviations Uninterruptible power system Water steam pressureDocumentation feedback Index Site preparation checklist
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.
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