IBM Major components of the BladeCenter HS40 Type 8839 blade server, Processor board Bezel

vDo not leave the device where others can handle and possibly damage the device.

vWhile the device is still in its static-protective package, touch it to an unpainted metal part of the BladeCenter unit or any unpainted metal surface on any other grounded rack component in the rack you are installing the device in for at least 2 seconds. This drains static electricity from the package and from your body.

vRemove the device from its package and install it directly into your blade server without setting it down. If it is necessary to set the device down, place it in its static-protective package. Do not place the device on your blade server cover or on a metal table.

vTake additional care when handling devices during cold weather. Heating reduces indoor humidity and increases static electricity.

Major components of the BladeCenter HS40 Type 8839 blade server

The following illustration shows the locations of major components in your blade server. You need to remove the blade server from the BladeCenter unit and remove the blade server cover to see the components.

Note: The illustrations in this document might differ slightly from your hardware.

Blade expansion connector terminator

Air baffle

Microprocessor heat-sink

(up to 4)

Microprocessor (up to 4)

Microprocessor heat-sink filler (up to 3)

Top cover

I/O board

DIMM (up to 8)

Processor board

Bezel

34BladeCenter HS40 Type 8839: Hardware Maintenance Manual and Troubleshooting Guide