IBM HS40 manual Heat-sink-retention, Microprocessor

The following illustration shows how to install the additional microprocessors on the processor board.

Heat sink	Heat-sink-retention
Microprocessor-locking lever	mechanism
Microprocessor	Microprocessor-
	heat-sink filler

Complete the following steps to install an additional microprocessor:

1.Review the safety information beginning on page 109 and “Installation guidelines” on page 33.

2.Shut down the operating system, turn off the blade server, and remove the blade server from the BladeCenter unit. See “Removing the blade server from the BladeCenter unit” on page 39 for instructions.

3.Carefully lay the blade server on a flat, nonconductive surface.

4.Open the blade server cover (see “Opening the blade server cover” on page 40 for instructions) and lift it off the blade server.

5.Lift and remove the air baffle covering the microprocessors.

6.Locate the microprocessor socket on the processor board. (See “Processor board components” on page 35 for numbering order of processors.)

Note: Processors must be installed in order, starting with microprocessor 1, then microprocessors 2, 3, and 4.

7.Using a #2 screwdriver, loosen the captive screw on the heat-sink retention mechanism, and rotate the mechanism up.

8.Remove the microprocessor heat-sink filler.

9.Install the microprocessor:

a.Remove the protective cover, tape, or label from the surface of the microprocessor socket, if one is present.

b.Touch the static-protective package containing the new microprocessor to any unpainted metal surface on the BladeCenter chassis or any unpainted surface on any other grounded rack component; then, remove the microprocessor from the package.

Attention: Do not use any tools or sharp objects to lift the locking lever on the microprocessor socket. Failure to do so might result in permanent damage to the processor board.

Chapter 4. Installing options 47