IBM MaxLoader manual Tqf, Tsop, UV Erasable, Verify, Word width

MaxLoader User’s Guide

	will be applied to the device for the first vector. Then, each output will be
	applied to the device for the first vector. This process will continue for each
	vector and any errors will be reported.
TQF	Thin Quad Flat Pack. Similar to QFP but with a lower profile and physically
	smaller in length and width.
TSOP	Thin Small Outline Package. A surface-mount package with fine-pitch leads
	(usually 0.025 inch pitch) on two sides. This package is very low profile and
	commonly available in a reverse (mirror image) pin out used to simplify
	circuit board layout; usually 32 to 44 pins.
UV Erasable	The characteristic of an EPROM that allows it to be erased with exposure to
	short –wave ultra-violet light. This high-energy light can discharge the
	floating-gate transistor cells that store bits in an EPROM. The most common
	source of such light is a mercury vapor tube much like an ordinary
	fluorescent tube, but without the phosphor that turns the UV light emitted by
	the mercury into visible light. The light from ordinary fluorescent lamps or
	sunlight generally takes years to erase an EPROM. All UV erasable parts
	have a quartz windowed ceramic package that allows exposure with UV light.
Verify	Reading a programmable device and comparing its contents to the desired
	pattern for that device. This is a go/no-go test – it does not report what the
	discrepancies are. See also: compare.
Word width	The number of output pins that a memory device has. The most common size
	for EPROMs is byte wide (8 bits) and “word” wide, or 16 bits. It can also
	refer to the aggregate width of several memory devices used in a set.

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