MaxLoader User’s Guide

 

will be applied to the device for the first vector. Then, each output will be

 

applied to the device for the first vector. This process will continue for each

 

vector and any errors will be reported.

TQF

Thin Quad Flat Pack. Similar to QFP but with a lower profile and physically

 

smaller in length and width.

TSOP

Thin Small Outline Package. A surface-mount package with fine-pitch leads

 

(usually 0.025 inch pitch) on two sides. This package is very low profile and

 

commonly available in a reverse (mirror image) pin out used to simplify

 

circuit board layout; usually 32 to 44 pins.

UV Erasable

The characteristic of an EPROM that allows it to be erased with exposure to

 

short –wave ultra-violet light. This high-energy light can discharge the

 

floating-gate transistor cells that store bits in an EPROM. The most common

 

source of such light is a mercury vapor tube much like an ordinary

 

fluorescent tube, but without the phosphor that turns the UV light emitted by

 

the mercury into visible light. The light from ordinary fluorescent lamps or

 

sunlight generally takes years to erase an EPROM. All UV erasable parts

 

have a quartz windowed ceramic package that allows exposure with UV light.

Verify

Reading a programmable device and comparing its contents to the desired

 

pattern for that device. This is a go/no-go test – it does not report what the

 

discrepancies are. See also: compare.

Word width

The number of output pins that a memory device has. The most common size

 

for EPROMs is byte wide (8 bits) and “word” wide, or 16 bits. It can also

 

refer to the aggregate width of several memory devices used in a set.

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IBM MaxLoader manual Tqf, Tsop, UV Erasable, Verify, Word width