Ampro Corporation COM 830 manual Environmental Specifications

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Chapter 2Specifications

Table 2-4. COM 830 Intel® Celeron M 423 1.07GHz 1MB L2 cache

COM 830-R-10

Intel® Celeron M 423 1.06GHz 1MB L2 cache

 

 

ULV 65nm

 

 

 

Memory Size

512MB

 

 

 

Operating System

Windows XP Professional SP2

 

 

Power State

Desktop Idle

100%

Standby (S1)

Suspend to

 

 

workload

 

Ram (S3)

Power consumption

1.26A/15.10W

1.90A/22.82W

1.60A/19.23W

0.82A/9.86W

(measured in Amperes/Watts)

 

 

 

 

 

 

 

 

 

NOTE All recorded power consumption values are approximate and only valid for the controlled environment described earlier. Power consumption results will vary depending on the workload of other components such as graphics engine, memory, etc.

Environmental Specifications

Temperature Operation: 0° to 60°C Storage: -20° to +80°C

Humidity Operation: 10% to 90% Storage: 5% to 95%

CAUTION The above operating temperatures must be strictly adhered to at all times. When using a heatspreader the maximum operating temperature refers to any measurable spot on the heatspreader's surface.

Ampro strongly recommends that you use the appropriate module heatspreader as a thermal interface between the module and your application’s cooling solution.

If for some reason it is not possible to use the appropriate module heatspreader, then it is the responsibility of the operator to ensure that all components found on the module operate within the component manufacturer’s specified temperature range.

COM 830

Reference Manual

9

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Contents COM Computer-On-Module Reference Manual Audience Contents Ahci RAID Appendix a Bios Setup DescriptionList of Tables AC97/Intel High Definition Audio Link Signals DescriptionsTerm Description SymbolsWarranty TerminologyPCI COM Express ConceptCOM 830 Options Information CertificationTechnical Support Lead-Free Designs RoHS Electrostatic Sensitive DeviceReference Manual COM Feature List Supported Operating Systems Mechanical Dimensions Power Usable MemoryElectrostatic Sensitive Device Supply Voltage Standard PowerPower Consumption Electrical CharacteristicsProcessor Information Environmental Specifications Intel 82945GM Block DiagramHeatspreader Heatspreader Dimensions Primary Connector Rows a and B Connector Subsystems Rows A, B, C, DGraphics Output VGA/CRT Power ControlPCI Express ExpressCardAdditional Features Power Supply Implementation GuidelinesOnboard Microcontroller Embedded BiosSimplified Overview of Bios Setup Data Backup Ampro Tech Notes Security FeaturesComparison of I/O Apic to 8259 PIC Interrupt mode Suspend to RamNative Mode Native vs. Compatible IDE modeIntel Processor Features Compatible ModeIntel Processor Performance ControlThermal Management Intel Virtualization TechnologyPassive Cooling ΔP% = TC1Tn-Tn-1 + TC2Tn-Tt Acpi Suspend Modes and Resume EventsActive Cooling Critical Trip PointGPI2# SMBALERT#WAKE# PME# USB 2.0 Ehci Host Controller Support Routing DiagramDDC PciePDS Connector Signal Descriptions Comment Gigabit Ethernet DescriptionSATA2TX SATA2RX+SATA2RX SATA2TX+PCIE4RX PCIE3TX+PCIE3TX PCIE4RX+USB1 USB0+USB0 USB1+USB7 VgaredVgagrn Commen I2CCK BiosdisableTvdacb TvdaccPwrok SysresetCBRESET# PWRBTN#Signal Description Comment Pin Row a Row B Connector PinoutLVDSA2 Rsvd EF+ BIOSDISABLE#LVDSA2+ LVDSB2+ GND FixedEXCD1CPPE# SYSRESET#EXCD1PERST# EXCD0PERST#Pcipar PCIRESET#PCITRDY# PCISTOP#Idereq IderesetPEGENABLE# IDEIOR#Pcie Sdvobgrn SDVOBRED+Pcie Sdvobred SDVOBGRN+TYPE2# TYPE1# TYPE0# TypePin Row C Row D PEGRX12 PEGRX12+PEGTX12+ PCIAD16AC ’97/Intel High Definition Boot Strap SignalsSignal Description of Boot Strap Signal Audio Serial Data Out This signalSystem Memory Map BiosSystem Resources Address Assignment0CFC 0CFF Address hex Size Available DescriptionInterrupt Request IRQ Lines Available Typical Interrupt Source Connected to PinPIC PCI Configuration Space Map IRQ14IRQ15 29. PCI Configuration Space Map Native Bus PCI Interrupt Routing MapAzalia ModeNative Root Port PCI Bus Masters²C Bus SM BusManufacturer Default Settings Entering the Bios Setup ProgramSetup Menu and Navigation Boot Selection PopupESC Main Setup ScreenFeature Options Description Bios IDAdvanced Setup Acpi Configuration Submenu YesAcpi PCI Configuration Submenu Win XP Watchdog Acpi Event restart configurationPCI Interrupt Routing Submenu Graphics Configuration SubmenuEnabled, 8MB PCI IRQ Resource Exclusion SubmenuLFP SDVO-C SDVO-B CRT + SdvoCRT + LFP LFP SDVO-B SDVO-CNtsc PAL Bios Secam SMPTE240MDVI CRT LvdsCPU Configuration Submenu Bios Setup Description Chipset Configuration Submenu IoapicApic Acpi SCI IRQ Interface Configuration Submenu 2F8/IRQ3 SIO Winbond W83627 ConfigurationDisabled 3F8/IRQ4IDE Clock ConfigurationIDE Configuration Submenu RAIDHost&Device CD/DVD Primary/Secondary IDE Master/Slave SubmenuAtapi Cdrom A.R.TEnabled HiSpeed USB Configuration SubmenuKeyboard/Mouse Configuration Submenu USB Mass Storage Device Configuration SubmenuCD-ROM Ansi Remote Access Configuration SubmenuBios Post COM2Hardware Monitoring Submenu +5VSBVbat NMI Watchdog Configuration SubmenuBoot Setup Boot Device Priority USB CdromPCI RAID Boot Settings Configuration Security Setup Hard Disk Security Security SettingsPower Setup Hard Disk Security User PasswordAPM Additional Bios Features Updating the BiosBios Recovery Bios Security Features Hard Disk Security FeaturesSerial Port and Console Redirection Industry Specifications Specification LinkLPC Reference Manual COM Method Contact Information Appendix a Technical SupportAppendix a