Ampro Corporation COM 830 manual Connector Signal Descriptions

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Chapter 3Signals and Pinout Tables

A-B Connector Signal Descriptions

Table 3-2. AC'97/Intel® High Definition Audio Link Signals Descriptions

Signal

Description

I/O

PU/PD

Comment

AC_RST#

AC ’97/Intel High Definition Audio Reset: This

O 3.3V

 

 

 

signal is the master hardware reset to external codec(s).

 

 

 

AC_SYN

AC ’97/Intel High Definition Audio Sync: This signal

O 3.3V

 

AC_SYN

C

is a 48 kHz fixed rate sample sync to the codec(s). It is

 

 

C is a boot

 

also used to encode the stream number.

 

 

strap

 

 

 

 

signal (see

 

 

 

 

note

 

 

 

 

below)

AC_BIT_

AC ’97 Bit Clock Input: This signal is a 12.288 MHz

I 3.3V

 

 

CLK

serial data clock generated by the external codec(s).

O 3.3V

 

 

 

This signal has an Intel integrated pull-down resistor.

 

 

 

 

 

 

 

Intel High Definition Audio Bit Clock Output: This

 

 

 

 

signal is a 24.000MHz serial data clock generated by

 

 

 

 

the Intel High Definition Audio controller (the Intel

 

 

 

 

ICH7M-DH). This signal has an Intel integrated pull-

 

 

 

 

down resistor so that AC_BIT_CLK doesn’t float when

 

 

 

 

an Intel High Definition Audio codec (or no codec) is

 

 

 

 

connected but the signals are temporarily configured as

 

 

 

 

AC ’97.

 

 

 

AC_SDO

AC ’97/Intel High Definition Audio Serial Data Out:

O 3.3V

 

AC_SDO

UT

This signal is the serial TDM data output to the

 

 

UT is a

 

codec(s). This serial output is double-pumped for a bit

 

 

boot strap

 

rate of 48 Mb/s for Intel High Definition Audio.

 

 

signal (see

 

 

 

 

note

 

 

 

 

below)

AC_SDIN

AC ’97//Intel High Definition Audio Serial Data In

I 3.3V

 

 

[2:0]

[0]: These signals are serial TDM data inputs from the

 

 

 

 

three codecs. The serial input is single-pumped for a bit

 

 

 

 

rate of 24 Mb/s for Intel High Definition Audio.

 

 

 

 

 

 

 

 

NOTE Some signals have special functionality during the reset process. They may bootstrap some basic important functions of the module.

26

Reference Manual

COM 830

Image 32
Contents COM Computer-On-Module Reference Manual Audience Contents Ahci RAID Bios Setup Description Appendix aAC97/Intel High Definition Audio Link Signals Descriptions List of TablesSymbols WarrantyTerminology Term DescriptionCOM Express Concept PCICertification Technical Support Lead-Free Designs RoHSElectrostatic Sensitive Device COM 830 Options InformationReference Manual COM Feature List Mechanical Dimensions PowerUsable Memory Supported Operating SystemsSupply Voltage Standard Power Power ConsumptionElectrical Characteristics Electrostatic Sensitive DeviceProcessor Information Environmental Specifications Block Diagram Intel 82945GMHeatspreader Heatspreader Dimensions Connector Subsystems Rows A, B, C, D Primary Connector Rows a and BPower Control PCI ExpressExpressCard Graphics Output VGA/CRTPower Supply Implementation Guidelines Additional FeaturesEmbedded Bios Onboard MicrocontrollerSimplified Overview of Bios Setup Data Backup Security Features Comparison of I/O Apic to 8259 PIC Interrupt modeSuspend to Ram Ampro Tech NotesNative vs. Compatible IDE mode Intel Processor FeaturesCompatible Mode Native ModeProcessor Performance Control IntelPassive Cooling Thermal ManagementIntel Virtualization Technology Acpi Suspend Modes and Resume Events Active CoolingCritical Trip Point ΔP% = TC1Tn-Tn-1 + TC2Tn-TtWAKE# PME# GPI2#SMBALERT# Routing Diagram USB 2.0 Ehci Host Controller SupportPDS DDCPcie Connector Signal Descriptions Gigabit Ethernet Description CommentSATA2RX+ SATA2RXSATA2TX+ SATA2TXPCIE3TX+ PCIE3TXPCIE4RX+ PCIE4RXUSB0+ USB0USB1+ USB1Vgagrn USB7Vgared Commen Biosdisable TvdacbTvdacc I2CCKSysreset CBRESET#PWRBTN# PwrokSignal Description Comment Connector Pinout Pin Row a Row BRsvd EF+ BIOSDISABLE# LVDSA2+LVDSB2+ GND Fixed LVDSA2SYSRESET# EXCD1PERST#EXCD0PERST# EXCD1CPPE#PCIRESET# PCITRDY#PCISTOP# PciparIdereset PEGENABLE#IDEIOR# IdereqSDVOBRED+ Pcie SdvobredSDVOBGRN+ Pcie SdvobgrnType TYPE2# TYPE1# TYPE0#Pin Row C Row D PEGRX12+ PEGTX12+PCIAD16 PEGRX12Boot Strap Signals Signal Description of Boot Strap SignalAudio Serial Data Out This signal AC ’97/Intel High DefinitionBios System ResourcesAddress Assignment System Memory MapAddress hex Size Available Description 0CFC 0CFFPIC Interrupt Request IRQ LinesAvailable Typical Interrupt Source Connected to Pin IRQ15 PCI Configuration Space MapIRQ14 29. PCI Configuration Space Map PCI Interrupt Routing Map AzaliaMode Native BusPCI Bus Masters ²C BusSM Bus Native Root PortEntering the Bios Setup Program Setup Menu and NavigationBoot Selection Popup Manufacturer Default SettingsMain Setup Screen Feature Options DescriptionBios ID ESCAdvanced Setup Acpi Acpi Configuration SubmenuYes Win XP Watchdog Acpi Event restart configuration PCI Configuration SubmenuGraphics Configuration Submenu Enabled, 8MBPCI IRQ Resource Exclusion Submenu PCI Interrupt Routing SubmenuCRT + Sdvo CRT + LFPLFP SDVO-B SDVO-C LFP SDVO-C SDVO-BPAL Bios Secam SMPTE240M DVICRT Lvds NtscCPU Configuration Submenu Bios Setup Description Apic Acpi SCI IRQ Chipset Configuration SubmenuIoapic Interface Configuration Submenu SIO Winbond W83627 Configuration Disabled3F8/IRQ4 2F8/IRQ3Clock Configuration IDE Configuration SubmenuRAID IDEHost&Device Primary/Secondary IDE Master/Slave Submenu Atapi CdromA.R.T CD/DVDEnabled USB Configuration Submenu HiSpeedCD-ROM Keyboard/Mouse Configuration SubmenuUSB Mass Storage Device Configuration Submenu Remote Access Configuration Submenu Bios PostCOM2 AnsiVbat Hardware Monitoring Submenu+5VSB Watchdog Configuration Submenu NMIBoot Setup PCI RAID Boot Device PriorityUSB Cdrom Boot Settings Configuration Security Setup Security Settings Hard Disk SecurityAPM Power SetupHard Disk Security User Password Bios Recovery Additional Bios FeaturesUpdating the Bios Serial Port and Console Redirection Bios Security FeaturesHard Disk Security Features LPC Industry SpecificationsSpecification Link Reference Manual COM Appendix a Technical Support Method Contact InformationAppendix a