Ampro Corporation COM 830 manual Certification, Technical Support Lead-Free Designs RoHS

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Chapter 1

About This Manual

Carrier board designers can utilize as little or as many of the I/O interfaces as necessary. The carrier board can therefore provide all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™ modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use of different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

Certification

Ampro is certified to DIN EN ISO 9001:2000 standard.

Technical Support

Ampro technicians and engineers are committed to providing the best possible technical support for our customers so that our products can be easily used and implemented. We request that you first visit our website at www.ampro.com for the latest documentation, utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support department by email at www.ampro.com.com/Support/.

Lead-Free Designs (RoHS)

As of July 2006 all electronic products are required to be environmentally friendly. In the future, many of the currently available embedded computer modules will not be offered as lead-free variants. For this reason all Ampro designs are created from lead-free components and are completely RoHS compliant. This makes Ampro products ideal lead-free substitutes for new and existing designs.

Electrostatic Sensitive Device

All Ampro products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle an Ampro product except at an electrostatic-free workstation. Additionally, do not ship or store Ampro products near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original manufacturer's packaging. Be aware that failure to comply with these guidelines will void the Ampro Limited Warranty.

COM 830 Options Information

The COM 830 is currently available in two different variants. This manual describes all of these options. Below you will find an order table showing the different configurations that are currently offered by Ampro. Check the table for the Part no./Order no. that applies to your product. This will tell you which options described in this manual are available on your particular module.

Table 1-3. COM 830 Configuration Matrix

Part-No.

COM 830-R-30

COM 830-R-10

CPU

Intel® Core™ Duo U2500 ULV

Intel® Celeron M 423 1.07GHz ULV

 

1.2GHz (Ultra Low Voltage)

(Ultra Low Voltage)

 

 

 

L2 Cache

2 MByte

1 MByte

 

 

 

FSB

533MHz

533MHz

 

 

 

CPU TDP

9 W

5.5 W

 

 

 

COM 830

Reference Manual

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Contents COM Computer-On-Module Reference Manual Audience Contents Ahci RAID Appendix a Bios Setup Description List of Tables AC97/Intel High Definition Audio Link Signals DescriptionsWarranty SymbolsTerminology Term DescriptionPCI COM Express ConceptTechnical Support Lead-Free Designs RoHS CertificationElectrostatic Sensitive Device COM 830 Options InformationReference Manual COM Feature List Power Mechanical DimensionsUsable Memory Supported Operating SystemsPower Consumption Supply Voltage Standard PowerElectrical Characteristics Electrostatic Sensitive DeviceProcessor Information Environmental Specifications Intel 82945GM Block DiagramHeatspreader Heatspreader Dimensions Primary Connector Rows a and B Connector Subsystems Rows A, B, C, DPCI Express Power ControlExpressCard Graphics Output VGA/CRTAdditional Features Power Supply Implementation GuidelinesOnboard Microcontroller Embedded BiosSimplified Overview of Bios Setup Data Backup Comparison of I/O Apic to 8259 PIC Interrupt mode Security FeaturesSuspend to Ram Ampro Tech NotesIntel Processor Features Native vs. Compatible IDE modeCompatible Mode Native ModeIntel Processor Performance ControlThermal Management Intel Virtualization TechnologyPassive Cooling Active Cooling Acpi Suspend Modes and Resume EventsCritical Trip Point ΔP% = TC1Tn-Tn-1 + TC2Tn-TtGPI2# SMBALERT#WAKE# PME# USB 2.0 Ehci Host Controller Support Routing DiagramDDC PciePDS Connector Signal Descriptions Comment Gigabit Ethernet DescriptionSATA2RX SATA2RX+SATA2TX+ SATA2TXPCIE3TX PCIE3TX+PCIE4RX+ PCIE4RXUSB0 USB0+USB1+ USB1USB7 VgaredVgagrn Commen Tvdacb BiosdisableTvdacc I2CCKCBRESET# SysresetPWRBTN# PwrokSignal Description Comment Pin Row a Row B Connector PinoutLVDSA2+ Rsvd EF+ BIOSDISABLE#LVDSB2+ GND Fixed LVDSA2EXCD1PERST# SYSRESET#EXCD0PERST# EXCD1CPPE#PCITRDY# PCIRESET#PCISTOP# PciparPEGENABLE# IderesetIDEIOR# IdereqPcie Sdvobred SDVOBRED+SDVOBGRN+ Pcie SdvobgrnTYPE2# TYPE1# TYPE0# TypePin Row C Row D PEGTX12+ PEGRX12+PCIAD16 PEGRX12Signal Description of Boot Strap Signal Boot Strap SignalsAudio Serial Data Out This signal AC ’97/Intel High DefinitionSystem Resources BiosAddress Assignment System Memory Map0CFC 0CFF Address hex Size Available DescriptionInterrupt Request IRQ Lines Available Typical Interrupt Source Connected to PinPIC PCI Configuration Space Map IRQ14IRQ15 29. PCI Configuration Space Map Azalia PCI Interrupt Routing MapMode Native Bus²C Bus PCI Bus MastersSM Bus Native Root PortSetup Menu and Navigation Entering the Bios Setup ProgramBoot Selection Popup Manufacturer Default SettingsFeature Options Description Main Setup ScreenBios ID ESCAdvanced Setup Acpi Configuration Submenu YesAcpi PCI Configuration Submenu Win XP Watchdog Acpi Event restart configurationEnabled, 8MB Graphics Configuration SubmenuPCI IRQ Resource Exclusion Submenu PCI Interrupt Routing SubmenuCRT + LFP CRT + SdvoLFP SDVO-B SDVO-C LFP SDVO-C SDVO-BDVI PAL Bios Secam SMPTE240MCRT Lvds NtscCPU Configuration Submenu Bios Setup Description Chipset Configuration Submenu IoapicApic Acpi SCI IRQ Interface Configuration Submenu Disabled SIO Winbond W83627 Configuration3F8/IRQ4 2F8/IRQ3IDE Configuration Submenu Clock ConfigurationRAID IDEHost&Device Atapi Cdrom Primary/Secondary IDE Master/Slave SubmenuA.R.T CD/DVDEnabled HiSpeed USB Configuration SubmenuKeyboard/Mouse Configuration Submenu USB Mass Storage Device Configuration SubmenuCD-ROM Bios Post Remote Access Configuration SubmenuCOM2 AnsiHardware Monitoring Submenu +5VSBVbat NMI Watchdog Configuration SubmenuBoot Setup Boot Device Priority USB CdromPCI RAID Boot Settings Configuration Security Setup Hard Disk Security Security SettingsPower Setup Hard Disk Security User PasswordAPM Additional Bios Features Updating the BiosBios Recovery Bios Security Features Hard Disk Security FeaturesSerial Port and Console Redirection Industry Specifications Specification LinkLPC Reference Manual COM Method Contact Information Appendix a Technical SupportAppendix a